[Closed] HBI Module Development Engineer at Intel (United States)

This position is no longer accepting applications.

Intel

1 week ago

HBI Module Development Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 2 minutes agoStatus: Closed

Job Summary

Drive process and/or equipment development for die-to-wafer hybrid bonding, optimizing parameters, characterizing equipment, and improving process control for advanced packaging. Lead DOE-based experimentation and statistical analysis to establish robust process windows and control strategies. Improve bond interface quality, alignment/overlay accuracy, contamination control, and yield/reliability/defectivity. Support first-of-a-kind capability development and partner with suppliers, vendors, and internal teams to advance hybrid bonding technology roadmaps.

Location: United States

Workplace: Hybrid

Employment Type: Full time

Job Function: Product Management

Seniority: Mid level

Key Responsibilities

•Drive process and/or equipment manufacturing development for die-to-wafer hybrid bonding, including parameter optimization, equipment characterization, and process control.
•Develop and optimize manufacturing processes to improve yield, reliability, and defectivity performance.
•Improve bond interface quality, alignment performance, overlay accuracy, surface preparation, and contamination control.
•Design and execute DOE-based experiments with statistical analysis to establish robust process windows and control strategies.
•Lead first-of-a-kind (FOK) process and equipment capability development and identify improvements to enhance manufacturing capability, efficiency, and output.

Pay and Benefits

Salary: USD 155,520 - 298,440 annually

Perks:Health InsuranceRetirement

Key Requirements

•Bachelor’s degree in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or related field plus 9+ years of industry experience; or Master’s with 6+ years; or PhD with 5+ years.
•Industry experience including 5+ years in hybrid bonding, wafer bonding, and advanced packaging.
•Experience with first-of-a-kind (FOK) process or equipment development programs.
•Knowledge of bond interface defect mechanisms (e.g., void formation, adhesion challenges, contamination effects, material interactions).
•Experience with process characterization, metrology, defect inspection, or failure analysis techniques.

Experience:5+ yearsHybrid bondingWafer bondingAdvanced packagingManufacturing

Education:Bachelor's in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related engineering/scientific field

Skills:CommunicationProblem-solvingCollaborationMentorshipPrioritization

Tech Stack:Hybrid bondingDie-to-wafer hybrid bondingDOEStatistical analysisProcess controlProcess characterizationModelingSimulationMetrologyDefect inspectionFailure analysisContamination controlAlignment performanceOverlay performance optimization

Company Brief

Intel

Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1968

Glassdoor: 3.8

Website LinkedIn Glassdoor

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This position is no longer accepting applications.

Intel

1 week ago

HBI Module Development Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 2 minutes agoStatus: Closed

Job Summary

Location: United States

Workplace: Hybrid

Employment Type: Full time

Job Function: Product Management

Seniority: Mid level

Key Responsibilities

•Drive process and/or equipment manufacturing development for die-to-wafer hybrid bonding, including parameter optimization, equipment characterization, and process control.
•Develop and optimize manufacturing processes to improve yield, reliability, and defectivity performance.
•Improve bond interface quality, alignment performance, overlay accuracy, surface preparation, and contamination control.
•Design and execute DOE-based experiments with statistical analysis to establish robust process windows and control strategies.
•Lead first-of-a-kind (FOK) process and equipment capability development and identify improvements to enhance manufacturing capability, efficiency, and output.

Pay and Benefits

Salary: USD 155,520 - 298,440 annually

Perks:Health InsuranceRetirement

Key Requirements

•Bachelor’s degree in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or related field plus 9+ years of industry experience; or Master’s with 6+ years; or PhD with 5+ years.
•Industry experience including 5+ years in hybrid bonding, wafer bonding, and advanced packaging.
•Experience with first-of-a-kind (FOK) process or equipment development programs.
•Knowledge of bond interface defect mechanisms (e.g., void formation, adhesion challenges, contamination effects, material interactions).
•Experience with process characterization, metrology, defect inspection, or failure analysis techniques.

Experience:5+ yearsHybrid bondingWafer bondingAdvanced packagingManufacturing

Education:Bachelor's in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related engineering/scientific field

Skills:CommunicationProblem-solvingCollaborationMentorshipPrioritization

Company Brief

Intel

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1968

Glassdoor: 3.8

Website LinkedIn Glassdoor