Intern - Design Architecture, HBM

Micron Technology
Texas, United States
Workplace: OnsiteInternshipFunction: Architecture & Urban PlanningEducation: mastersSkills: ["Ability to learn","Technical analysis","Technical communication"]

Support Micron’s HBM Design Architecture team in early-stage research for next-generation AI memory and system environments. You’ll analyze bandwidth, latency, and system-level memory requirements, help develop simulation frameworks to model AI cluster performance, and build trend dashboards using CSP benchmarks and industry datasets. Work closely with senior engineers and DTPCO mentors to explore architectural intercept opportunities and translate findings into clear technical recommendations.

Loading

Loading job details...

Preparing the role view and application actions.

FursaFursa
Micron Technology
Micron Technology
1 week ago

Intern - Design Architecture, HBM

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 4 hours agoStatus: Live

Job Summary

Support Micron’s HBM Design Architecture team in early-stage research for next-generation AI memory and system environments. You’ll analyze bandwidth, latency, and system-level memory requirements, help develop simulation frameworks to model AI cluster performance, and build trend dashboards using CSP benchmarks and industry datasets. Work closely with senior engineers and DTPCO mentors to explore architectural intercept opportunities and translate findings into clear technical recommendations.
Location: Texas, United States
Workplace: Onsite
Employment Type: Internship
Job Function: Architecture & Urban Planning
Seniority: Intern level

Key Responsibilities

  • •Research emerging trends in compute, networking, and storage infrastructure to anticipate how future AI workloads evolve.
  • •Gather and synthesize data to support HBM architecture analysis, including bandwidth, latency, and system-level memory requirements.
  • •Help develop or refine simulation frameworks to model AI cluster performance and memory subsystem behavior.
  • •Participate in building trend dashboards using CSP benchmarks and industry datasets.
  • •Collaborate with DTPCO mentors to explore architectural intercept opportunities for next-generation AI systems.

Pay and Benefits

Perks:Health InsuranceDentalVisionPaid LeavePaid HolidaysIncome Protection

Key Requirements

  • •Currently pursuing a Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field.
  • •Cannot graduate prior to September 2027.
  • •Foundational understanding of computer architecture, digital systems, and hardware/software interaction.
  • •Programming experience in Python, C/C++, or similar languages.
  • •Ability to learn new tools, simulation frameworks, and data-analysis workflows.
Education:Master's in Electrical Engineering, Computer Engineering, Computer Science, or a related field
Skills:Ability to learnTechnical analysisTechnical communication
Tech Stack:PythonC/C++Simulation frameworksCSP benchmarksLLMsMachine learning

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
Glassdoor
Glassdoor: 3.7
WebsiteLinkedIn