Applied Materials

4 months ago

Senior Technical Manager - Advanced Packaging

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 6 hours agoStatus: Live

Job Summary

Lead technology development programs and drive adoption of advanced packaging capabilities with customers in the Advanced Packaging Technology Team. Serve as a primary technical interface to TSMC’s Advanced Packaging organization, coordinate customer evaluations, and oversee high-visibility onsite installations and troubleshooting. Partner with R&D and cross-functional engineering teams to run DOE-based experiments, analyze statistical results, perform root-cause analysis, and translate findings into process and product improvements.

Location: Taiwan

Workplace: Onsite

Employment Type: Full time

Job Function: Solutions Engineering & Sales Engineering

Seniority: Manager level

Key Responsibilities

•Engage with customers to understand roadmaps, interpret technology needs, and identify Applied Materials engagement opportunities.
•Drive adoption of new technology through demos, on-site evaluations, joint development programs, and tool qualifications.
•Serve as a liaison between the customer and business unit for assigned projects to ensure delivery of applicable solutions.
•Lead teams providing high-visibility customer support through on-site installations, system diagnoses, and service/repair of complex systems.
•Develop leading-edge processes via hypothesis experiments and DOE, analyze data with statistics, and conduct troubleshooting with root cause analysis to resolve complex issues.

Key Requirements

•Master’s degree in Materials Science, Chemical Engineering, Electrical Engineering, or a related field (Ph.D. is a plus).
•10+ years of semiconductor industry experience, preferably with exposure to advanced packaging R&D or process integration.
•Proven technical project leadership, including new technology evaluation and customer engagement.
•Hands-on experience working with cross-functional engineering teams to drive complex technical programs to completion.
•Strong communication skills; ability to represent technical positions clearly to internal teams and customer engineers (English and Mandarin required).

Experience:10+ yearsSemiconductorAdvanced packagingR&DProcess integration

Education:Master's in Materials Science, Chemical Engineering, Electrical Engineering (or related field)

Skills:CommunicationTechnical project leadershipCustomer engagementCross-functional collaborationTroubleshootingRoot cause analysis

Languages:EnglishMandarin

Tech Stack:Chemical Vapor DepositionAtomic Layer DepositionPlasma Reactive Ion EtchPhysical Vapor DepositionAnnealImplantDesign of Experiments (DOE)StatisticsData analysisRoot cause analysis

Company Brief

Applied Materials

Provides semiconductor manufacturing equipment, services, and software used to build advanced chips and display technologies. Its tools support materials engineering, deposition, etching, inspection, and process control for major electronics manufacturers worldwide.

Industry: Industrial Machinery

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1967

Glassdoor: 3.9

Website LinkedIn Glassdoor

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Applied Materials

4 months ago

Senior Technical Manager - Advanced Packaging

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 6 hours agoStatus: Live

Job Summary

Location: Taiwan

Workplace: Onsite

Employment Type: Full time

Job Function: Solutions Engineering & Sales Engineering

Seniority: Manager level

Key Responsibilities

•Engage with customers to understand roadmaps, interpret technology needs, and identify Applied Materials engagement opportunities.
•Drive adoption of new technology through demos, on-site evaluations, joint development programs, and tool qualifications.
•Serve as a liaison between the customer and business unit for assigned projects to ensure delivery of applicable solutions.
•Lead teams providing high-visibility customer support through on-site installations, system diagnoses, and service/repair of complex systems.
•Develop leading-edge processes via hypothesis experiments and DOE, analyze data with statistics, and conduct troubleshooting with root cause analysis to resolve complex issues.

Key Requirements

•Master’s degree in Materials Science, Chemical Engineering, Electrical Engineering, or a related field (Ph.D. is a plus).
•10+ years of semiconductor industry experience, preferably with exposure to advanced packaging R&D or process integration.
•Proven technical project leadership, including new technology evaluation and customer engagement.
•Hands-on experience working with cross-functional engineering teams to drive complex technical programs to completion.
•Strong communication skills; ability to represent technical positions clearly to internal teams and customer engineers (English and Mandarin required).

Experience:10+ yearsSemiconductorAdvanced packagingR&DProcess integration

Education:Master's in Materials Science, Chemical Engineering, Electrical Engineering (or related field)

Skills:CommunicationTechnical project leadershipCustomer engagementCross-functional collaborationTroubleshootingRoot cause analysis

Languages:EnglishMandarin

Tech Stack:Chemical Vapor DepositionAtomic Layer DepositionPlasma Reactive Ion EtchPhysical Vapor DepositionAnnealImplantDesign of Experiments (DOE)StatisticsData analysisRoot cause analysis

Company Brief

Applied Materials

Industry: Industrial Machinery

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1967

Glassdoor: 3.9

Website LinkedIn Glassdoor