Die Prep Module Engineer (Contract Role)

Intel
Malaysia
Workplace: OnsiteContractFunction: Communications, PR & CommunityExperience: 2+ yearsEducation: bachelorsSkills: ["Communication","Cross-functional collaboration","Structured problem-solving","Technical presentation","Troubleshooting"]

Own and stabilize pick-and-place (PnP) process parameters for high-precision die preparation assembly equipment. Optimize high-speed processes to improve yield, equipment uptime, OEE, and process stability. Lead troubleshooting and maintenance strategy with vendor collaboration, using SPC, DOE, FMEA, and RCA to drive root-cause solutions. Partner with cross-functional process owners and R&D to transfer and ramp new products, and standardize SOPs and technical documentation for factory stakeholders.

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Intel
Intel
2 days ago

Die Prep Module Engineer (Contract Role)

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Job Summary

Own and stabilize pick-and-place (PnP) process parameters for high-precision die preparation assembly equipment. Optimize high-speed processes to improve yield, equipment uptime, OEE, and process stability. Lead troubleshooting and maintenance strategy with vendor collaboration, using SPC, DOE, FMEA, and RCA to drive root-cause solutions. Partner with cross-functional process owners and R&D to transfer and ramp new products, and standardize SOPs and technical documentation for factory stakeholders.
Location: Malaysia
Workplace: Onsite
Employment Type: Contract
Job Function: Communications, PR & Community
Seniority: Entry level

Key Responsibilities

  • •Own, stabilize, and optimize pick-and-place/PnP process parameters to drive yield improvements and resolve process integration issues.
  • •Lead complex troubleshooting and preventive/corrective maintenance strategies; collaborate with tool vendors to upgrade hardware/software.
  • •Use SPC, DOE, and FMEA to identify root causes of process drift or hardware failures.
  • •Collaborate with upstream/downstream process owners and R&D to transfer and ramp new products (NPI).
  • •Standardize SOPs, document troubleshooting guides, and present technical findings and progress updates to factory stakeholders.

Key Requirements

  • •Bachelor/Master degree in Electrical/Electronics, Mechanical, Mechatronics, or Materials Engineering with at least 2 years of work experience.
  • •Fresh graduate welcome to apply.
  • •Knowledge of semiconductor back-end assembly, specifically Die Preparation and pick-and-place (PnP) processes.
  • •Basic understanding of Statistical Process Control (SPC) and statistical data analysis, with structured problem-solving.
  • •Expertise in Design of Experiments (DOE), Failure Mode and Effects Analysis (FMEA), and Root Cause Analysis (RCA) (FMEA/RCA is an added advantage).
Experience:2+ yearsSemiconductor manufacturingSemiconductor back-endDie preparationPick-and-place (PnP)
Education:Bachelor's in Electrical / Electronics / Mechanical / Mechatronics and Materials Engineering
Skills:CommunicationCross-functional collaborationStructured problem-solvingTechnical presentationTroubleshooting
Tech Stack:Pick and PlacePnPStatistical Process Control (SPC)SPCDesign of Experiments (DOE)DOEFailure Mode and Effects Analysis (FMEA)FMEARoot Cause Analysis (RCA)Failure Mode and Effects Analysis

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
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Glassdoor: 3.8
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