Broadcom

3 weeks ago

Substrate Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 6 hours agoStatus: Live

Job Summary

Work with IC substrate subcontractors to resolve packaging and high-volume manufacturing issues, improving yield, quality, and delivery. Lead NPI activities, risk assessments, process improvement, and production engineering support for IC substrate manufacturing. Partner with cross-functional engineering teams to mature newly developed packaging technologies and drive pre-production engineering improvements in mechanical yields and cycle time. Standardize best-known methods, enhance capability, and reduce cost while supporting site activities across Asia.

Location: Taiwan

Workplace: Onsite

Employment Type: Full time

Job Function: Industrial, Process & Manufacturing Engineering

Key Responsibilities

•Manage and resolve packaging/manufacturing/yield/quality/delivery issues with IC substrate subcontractors for high-volume semiconductor devices.
•Lead NPI activities, risk assessments, and production engineering support for high-volume IC substrate manufacturing.
•Collaborate with internal cross-functional engineering teams on issue resolution and to mature newly developed packaging technologies.
•Drive pre-production engineering activities and improvements in process and visual mechanical yields and cycle time.
•Standardize best-known methods and verify compliance with Broadcom requirements; drive capability enhancement and cost reduction projects.

Travel: High travel

Key Requirements

•Bachelor’s degree in an engineering discipline (Mechanical, Manufacturing, Material Science, Chemical or Electrical).
•8+ years of experience in IC substrate manufacturing technologies and processes.
•Direct process and operational experience in a substrate manufacturing operations line in a manufacturing environment.
•Expertise in ABF substrate interactions with Ball Grid Arrays, flipchip, and laminate substrate processes (die attach, wirebonding, molding, flipchip attach, singulation, packaging materials).
•Proven ability to coordinate complex activities across operations, quality, business units, suppliers, marketing, and customers, using problem-solving methodologies and failure analysis; strong English and fluent Mandarin.

Experience:8+ yearsSemiconductor manufacturingIC substrate manufacturingHigh-volume manufacturingPackagingNPI

Education:Bachelor's in Engineering discipline (Mechanical, Manufacturing, Material Science, Chemical, Electrical)

Skills:Problem-solvingRisk assessmentFailure analysisLeadershipCommunication

Languages:EnglishMandarin

Tech Stack:ABF substrateBall Grid ArraysBGAFlipchipLaminate substratesDie attachWirebondingMoldingFlipchip attachSingulationSMTInteractive natureNPI

Company Brief

Broadcom

Designs, develops, and supplies a broad range of semiconductor and infrastructure software solutions for the data center, networking, broadband, wireless, storage, and industrial markets worldwide.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Irvine, United States

Founded: 1991

Website LinkedIn

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Broadcom

3 weeks ago

Substrate Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 6 hours agoStatus: Live

Job Summary

Location: Taiwan

Workplace: Onsite

Employment Type: Full time

Job Function: Industrial, Process & Manufacturing Engineering

Key Responsibilities

•Manage and resolve packaging/manufacturing/yield/quality/delivery issues with IC substrate subcontractors for high-volume semiconductor devices.
•Lead NPI activities, risk assessments, and production engineering support for high-volume IC substrate manufacturing.
•Collaborate with internal cross-functional engineering teams on issue resolution and to mature newly developed packaging technologies.
•Drive pre-production engineering activities and improvements in process and visual mechanical yields and cycle time.
•Standardize best-known methods and verify compliance with Broadcom requirements; drive capability enhancement and cost reduction projects.

Travel: High travel

Key Requirements

•Bachelor’s degree in an engineering discipline (Mechanical, Manufacturing, Material Science, Chemical or Electrical).
•8+ years of experience in IC substrate manufacturing technologies and processes.
•Direct process and operational experience in a substrate manufacturing operations line in a manufacturing environment.
•Expertise in ABF substrate interactions with Ball Grid Arrays, flipchip, and laminate substrate processes (die attach, wirebonding, molding, flipchip attach, singulation, packaging materials).
•Proven ability to coordinate complex activities across operations, quality, business units, suppliers, marketing, and customers, using problem-solving methodologies and failure analysis; strong English and fluent Mandarin.

Experience:8+ yearsSemiconductor manufacturingIC substrate manufacturingHigh-volume manufacturingPackagingNPI

Education:Bachelor's in Engineering discipline (Mechanical, Manufacturing, Material Science, Chemical, Electrical)

Skills:Problem-solvingRisk assessmentFailure analysisLeadershipCommunication

Languages:EnglishMandarin

Tech Stack:ABF substrateBall Grid ArraysBGAFlipchipLaminate substratesDie attachWirebondingMoldingFlipchip attachSingulationSMTInteractive natureNPI

Company Brief

Broadcom

Designs, develops, and supplies a broad range of semiconductor and infrastructure software solutions for the data center, networking, broadband, wireless, storage, and industrial markets worldwide.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Irvine, United States

Founded: 1991

Website LinkedIn