Cisco

3 months ago

ASIC Package Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 1 hour agoStatus: Live

Job Summary

Join Cisco’s ASIC Group as an ASIC Mechanical Engineer focusing on mechanical and thermomechanical simulations of ASIC packages and substrates. You’ll perform FEA to assess thermal-mechanical stress and solder joint reliability, develop automated workflows in Python/Fortran, collaborate globally across packaging, reliability, thermal and hardware teams, and help optimize designs early in development with data-driven analysis.

Location: Taipei

Workplace: Hybrid

Employment Type: Full time

Job Function: Hardware, Embedded & Systems Engineering

Key Responsibilities

•Perform finite element analysis to evaluate thermal mechanical stress, warpage, and solder joint reliability of ASIC packages, substrates, and advanced packaging assemblies.
•Simulate and analyze linear and nonlinear material behaviors (plasticity, creep, viscoelasticity) relevant to solder joints, copper, stiffeners, and underfills.
•Develop and automate simulation workflows using Python, Fortran or similar scripting tools to streamline analysis and reporting.
•Provide clear simulation results to support mechanical design, root cause analysis, and risk mitigation.
•Document and present analysis results, assumptions, and design recommendations in a clear, structured format.

Key Requirements

•Bachelor’s degree or higher with 7 years of related experience, or Master’s with 4 years, or PhD with 1 year of related experience.
•At least 3 years of experience in mechanical design and thermomechanical simulation of semiconductor packages.
•Hands-on experience with 3D modeling and finite element analysis using ABAQUS or ANSYS.
•Ability to coordinate and communicate across different time zones supporting global project teams in US and Asia.
•Preferred: 5+ years of experience in mechanical or thermomechanical simulation of semiconductors or electronics packaging systems.

Experience:3+ yearsSemiconductorsElectronics packagingHardware engineering

Education:Bachelor's

Skills:PythonFortranCADAUTOCADCREOGD&T3D modelingFinite element analysisABAQUSANSYSScripting

Tech Stack:PythonFortranABAQUSANSYSCADAUTOCADCREO

Company Brief

Cisco

Global technology company that designs, manufactures, and sells networking hardware, telecommunications equipment, and high-technology services and products for enterprises, service providers, and governments worldwide.

Industry: Networking Equipment

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: San Jose, United States

Founded: 1984

Glassdoor: 4.0

Website LinkedIn Glassdoor

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Cisco

3 months ago

ASIC Package Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 1 hour agoStatus: Live

Job Summary

Location: Taipei

Workplace: Hybrid

Employment Type: Full time

Job Function: Hardware, Embedded & Systems Engineering

Key Responsibilities

•Perform finite element analysis to evaluate thermal mechanical stress, warpage, and solder joint reliability of ASIC packages, substrates, and advanced packaging assemblies.
•Simulate and analyze linear and nonlinear material behaviors (plasticity, creep, viscoelasticity) relevant to solder joints, copper, stiffeners, and underfills.
•Develop and automate simulation workflows using Python, Fortran or similar scripting tools to streamline analysis and reporting.
•Provide clear simulation results to support mechanical design, root cause analysis, and risk mitigation.
•Document and present analysis results, assumptions, and design recommendations in a clear, structured format.

Key Requirements

•Bachelor’s degree or higher with 7 years of related experience, or Master’s with 4 years, or PhD with 1 year of related experience.
•At least 3 years of experience in mechanical design and thermomechanical simulation of semiconductor packages.
•Hands-on experience with 3D modeling and finite element analysis using ABAQUS or ANSYS.
•Ability to coordinate and communicate across different time zones supporting global project teams in US and Asia.
•Preferred: 5+ years of experience in mechanical or thermomechanical simulation of semiconductors or electronics packaging systems.

Experience:3+ yearsSemiconductorsElectronics packagingHardware engineering

Education:Bachelor's

Skills:PythonFortranCADAUTOCADCREOGD&T3D modelingFinite element analysisABAQUSANSYSScripting

Tech Stack:PythonFortranABAQUSANSYSCADAUTOCADCREO

Company Brief

Cisco

Industry: Networking Equipment

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: San Jose, United States

Founded: 1984

Glassdoor: 4.0

Website LinkedIn Glassdoor