Packaging Substrate Development Engineer

AMD
Austin
Workplace: HybridFull timeUSD 127,190 - 218,040 annuallyFunction: Product ManagementSkills: ["Communication","Cross-functional collaboration","Hands-on problem solving","Stakeholder management","Team leadership"]

Lead the development of advanced packaging substrate and board technologies to support AMD’s product roadmap. Define substrate/board technology roadmaps across pitch scaling, power delivery, signal integrity, and cost. Partner with architects, designers, and product owners to create high-yield, cost-effective substrate solutions; select development partners; and collaborate with product, quality, and manufacturing engineering to achieve manufacturability, yield, and reliability from concept through NPI. Qualify substrates to meet cost and yield targets.

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FursaFursa
AMD
AMD
1 day ago

Packaging Substrate Development Engineer

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Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 11 hours agoStatus: Live

Job Summary

Lead the development of advanced packaging substrate and board technologies to support AMD’s product roadmap. Define substrate/board technology roadmaps across pitch scaling, power delivery, signal integrity, and cost. Partner with architects, designers, and product owners to create high-yield, cost-effective substrate solutions; select development partners; and collaborate with product, quality, and manufacturing engineering to achieve manufacturability, yield, and reliability from concept through NPI. Qualify substrates to meet cost and yield targets.
Location: Austin
Workplace: Hybrid
Employment Type: Full time
Job Function: Product Management

Key Responsibilities

  • •Define advanced substrate and board technology roadmap across pitch scaling, power delivery, signal integrity, and cost vectors.
  • •Partner with architects, designers, and product owners to define high-yield, cost-effective substrate solutions meeting product requirements.
  • •Select development partners to bring into the AMD supply chain to enable industry-leading substrate and PCB technology building blocks.
  • •Partner with product, quality, and manufacturing engineering teams to meet milestones for manufacturability, yield, and reliability from concept through NPI.
  • •Qualify package substrates for new products to meet cost and yield targets.

Pay and Benefits

Salary: USD 127,190 - 218,040 annually

Key Requirements

  • •BS/MS/PhD in solid state physics, chemistry, material science, chemical engineering, or equivalent.
  • •Hands-on approach with excellent oral and written communication skills for stakeholder and global cross-functional communication.
  • •Experience developing advanced packaging technologies at a substrate supplier, OSAT, or Fabless/IDM.
  • •Deep knowledge of packaging and board design rules, process flows, materials, and equipment.
  • •Experience leading cross-functional teams for technology certification and yield/cost reduction initiatives, including equipment setup.
Education:
Skills:CommunicationCross-functional collaborationHands-on problem solvingStakeholder managementTeam leadership
Languages:En-us

Eligibility

Work Authorization:Authorization required. Sponsorship not provided.

Company Brief

AMD
Designs and produces semiconductor products including CPUs, GPUs, and adaptive SoCs for consumer, enterprise, and embedded markets, competing across PCs, data centers, and gaming industries.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1969
Glassdoor
Glassdoor: 3.9
WebsiteLinkedIn