IC Package design engineer- 4+ Years

Cisco
Bengaluru
Workplace: HybridFull timeFunction: Design (Product/UX/UI/Visual)Experience: 3+ yearsSkills: ["Mentoring","Collaboration","Design methodology improvement","Strategic planning","Vendor partnership"]

Join Cisco Silicon One’s Package Design Team to design and optimize advanced silicon package solutions for next-generation networking ASICs. As a lead engineer, drive the full package design process from planning and optimization through execution, improving performance and manufacturability. Collaborate with floor planning, signal integrity, and power integrity teams, work with layout editors, enhance design methodologies, and mentor engineers while partnering with vendors to raise quality and efficiency.

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FursaFursa
Cisco
Cisco
6 months ago

IC Package design engineer- 4+ Years

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Last checked: 4 hours agoStatus: Live

Job Summary

Join Cisco Silicon One’s Package Design Team to design and optimize advanced silicon package solutions for next-generation networking ASICs. As a lead engineer, drive the full package design process from planning and optimization through execution, improving performance and manufacturability. Collaborate with floor planning, signal integrity, and power integrity teams, work with layout editors, enhance design methodologies, and mentor engineers while partnering with vendors to raise quality and efficiency.
Location: Bengaluru
Workplace: Hybrid
Employment Type: Full time
Job Function: Design (Product/UX/UI/Visual)
Seniority: Mid level

Key Responsibilities

  • •Lead package design tasks, planning, and schedules from concept through implementation.
  • •Optimize package pinouts, stack-ups, power distribution, and high-speed routing to balance performance and manufacturability.
  • •Collaborate with silicon floor planning, signal integrity (SI), and power integrity (PI) teams to ensure design quality and efficiency.
  • •Work with layout editors to deliver high-quality package designs aligned with interface requirements.
  • •Enhance design methodologies and partner with vendors to improve product quality and efficiency.

Key Requirements

  • •Over 3 years of experience in package layout design.
  • •Skilled in high-speed layout design such as PCIe, DDR, and SerDes technologies.
  • •Proficient in using the Cadence APD layout tool.
  • •Experience with multi-die package and interposer designs.
  • •Ability to deliver high-quality package designs aligned with interface requirements.
Experience:3+ years
Skills:MentoringCollaborationDesign methodology improvementStrategic planningVendor partnership
Tech Stack:Cadence APDCadencePCIeDDRSerDes

Company Brief

Cisco
Global technology company that designs, manufactures, and sells networking hardware, telecommunications equipment, and high-technology services and products for enterprises, service providers, and governments worldwide.
Industry: Networking Equipment
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: San Jose, United States
Founded: 1984
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