Principal/Staff Engineer Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityExperience: 2+ yearsSkills: ["Collaboration","Tenacity","Problem-solving","Root cause analysis","Continuous improvement"]

Develop and optimize assembly processes for advanced packaging technologies such as wafer-level packaging and die stacking (chip on wafer, chip to wafer). Evaluate equipment and materials, establish process parameters, and drive quality improvements through defense coverage, measurement/inspection/testing, and data-driven control strategies. Partner across internal teams to integrate and transition technology from new development through qualification and high-volume manufacturing, delivering POR/MOR documentation.

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FursaFursa
Micron Technology
Micron Technology
3 weeks ago

Principal/Staff Engineer Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering

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Source: Company careers pageValidated by: Fursa AI
Last checked: 7 hours agoStatus: Live

Job Summary

Develop and optimize assembly processes for advanced packaging technologies such as wafer-level packaging and die stacking (chip on wafer, chip to wafer). Evaluate equipment and materials, establish process parameters, and drive quality improvements through defense coverage, measurement/inspection/testing, and data-driven control strategies. Partner across internal teams to integrate and transition technology from new development through qualification and high-volume manufacturing, delivering POR/MOR documentation.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Develop and optimize assembly processes for advanced packaging technologies, including wafer-level packaging and die stacking (chip on wafer, chip to wafer) to improve quality, yield, cost, and productivity.
  • •Establish and improve process management projects to deliver technology node requirements.
  • •Evaluate and promote new equipment and materials; set process parameters and plan for new equipment and materials.
  • •Ensure quality improvement through process/measurement/inspection/testing, correlate defense mechanisms to identify opportunities, and perform continuous data analysis to enable advanced controls.
  • •Coordinate cross-functional technology development and integration, provide POR/MOR documentation, and support smooth transitions from development through qualification, small-volume production, and high-volume manufacturing.

Key Requirements

  • •B.S./M.S./Ph.D. (or equivalent) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or a related technical field.
  • •2+ years of semiconductor process development or equipment evaluation, preferably in wafer bonding, die stacking, and packaging.
  • •Proficiency in Python, R, and SQL for statistical analysis, process modeling, and data analytics.
  • •Experience with Visual Basic for automation and tool integration, and familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System).
  • •Strong data analytics for SPC, DOE, defect analysis, and dashboarding, plus a strong understanding of process flows and how changes affect yield, performance, and reliability.
Experience:2+ yearsSemiconductorAdvanced packagingWafer bondingDie stackingProcess development
Education:
Skills:CollaborationTenacityProblem-solvingRoot cause analysisContinuous improvement
Tech Stack:PythonRSQLVisual BasicE3FDCRMSSPCDOEAutoCAD

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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