Senior Staff Advance Packaging Engineer

AMD
Singapore
Workplace: OnsiteFull timeSGD 112,700 - 161,000 annuallyFunction: Solutions Engineering & Sales EngineeringEducation: bachelorsSkills: ["Ownership","Accountability","Collaboration","Communication","Fast execution"]

Lead end-to-end advance packaging design execution for complex products, driving performance, cost, quality, and schedule targets across multiple concurrent programs. Develop substrate layouts, bump maps, and interposer designs for 2.5D/3D chiplet-based architectures, while collaborating closely with SI/PI, mechanical, and SoC teams. Advance packaging methodologies using AI-driven design techniques, automation, and next-generation workflows, and mentor junior engineers through design reviews and tapeout readiness.

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FursaFursa
AMD
AMD
2 days ago

Senior Staff Advance Packaging Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 22 hours agoStatus: Live

Job Summary

Lead end-to-end advance packaging design execution for complex products, driving performance, cost, quality, and schedule targets across multiple concurrent programs. Develop substrate layouts, bump maps, and interposer designs for 2.5D/3D chiplet-based architectures, while collaborating closely with SI/PI, mechanical, and SoC teams. Advance packaging methodologies using AI-driven design techniques, automation, and next-generation workflows, and mentor junior engineers through design reviews and tapeout readiness.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Solutions Engineering & Sales Engineering
Seniority: Mid level

Key Responsibilities

  • •Lead end-to-end advance packaging design execution for complex products, meeting performance, cost, quality, and schedule targets.
  • •Handle multiple concurrent design programs in fast-paced, high-pressure environments.
  • •Develop substrate layouts, bump maps, and interposer designs for advanced packaging (2.5D/3D, chiplet-based).
  • •Drive design decisions by collaborating with SI/PI, mechanical, and SoC teams and supporting design reviews, signoff readiness, and tapeout processes.
  • •Define and enhance packaging methodologies and flows, improving layout efficiency, reuse, and design standardization; mentor junior engineers.

Pay and Benefits

Salary: SGD 112,700 - 161,000 annually

Key Requirements

  • •Bachelor’s degree or higher in Electrical Engineering, Computer Engineering, or a related field.
  • •Experienced package or silicon physical designer with strong ownership across multiple programs.
  • •Hands-on experience designing complex substrate layouts and/or Silicon Bridge/interposers for advanced packaging (2.5D/3D, chiplet-based).
  • •Ability to apply AI/ML and automation to improve design productivity and quality in fast-phased, high-pressure execution.
  • •Solid understanding of Signal Integrity and Power Integrity fundamentals and experience working with OSATs, foundries, and substrate vendors.
Education:Bachelor's in Electrical Engineering, Computer Engineering, or related field
Skills:OwnershipAccountabilityCollaborationCommunicationFast execution
Languages:En-us
Tech Stack:AI/MLAutomation2.5D3DChiplet-based architecturesEDA toolsSignal integrityPower integritySubstrate layoutsBump mapsInterposers

Company Brief

AMD
Designs and produces semiconductor products including CPUs, GPUs, and adaptive SoCs for consumer, enterprise, and embedded markets, competing across PCs, data centers, and gaming industries.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1969
Glassdoor
Glassdoor: 3.9
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