Front End Central Product Integration Senior / Staff / Principal / Engineer, Test & Product Yield Integration

Micron Technology
Japan
Workplace: OnsiteFull timeFunction: Solutions Engineering & Sales EngineeringEducation: high_schoolSkills: ["Technical leadership","Data analysis","Debugging","Cross-functional collaboration","Communication"]

Provide technical leadership across the Micron network to improve yield, product quality, and New Product Introduction (NPI) by integrating test flow, product design, packaging, and manufacturing insights. Drive global product integration initiatives, centralize cross-site project information, and resolve yield/quality challenges through cross-functional taskforces. Characterize device failure modes, standardize best-known methods, communicate risks and progress, and travel to fab and development sites as needed.

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Micron Technology
Micron Technology
5 months ago

Front End Central Product Integration Senior / Staff / Principal / Engineer, Test & Product Yield Integration

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Job Summary

Provide technical leadership across the Micron network to improve yield, product quality, and New Product Introduction (NPI) by integrating test flow, product design, packaging, and manufacturing insights. Drive global product integration initiatives, centralize cross-site project information, and resolve yield/quality challenges through cross-functional taskforces. Characterize device failure modes, standardize best-known methods, communicate risks and progress, and travel to fab and development sites as needed.
Location: Japan
Workplace: Onsite
Employment Type: Full time
Job Function: Solutions Engineering & Sales Engineering
Seniority: Mid level

Key Responsibilities

  • •Lead and drive global Product Integration initiatives to improve yield, quality, and benchmark performance across technology nodes and products.
  • •Centralize and synthesize project information from multiple global teams and drive execution to closure.
  • •Drive yield breakthroughs by understanding the end-to-end test flow, product design/operation, packaging interactions, and manufacturing processes while balancing yield vs. reliability.
  • •Define and drive strategies to ensure Packaging Technology and Chip-Package Interaction are developed and qualified ahead of product qualification.
  • •Lead cross-functional and cross-site taskforces to resolve yield and quality challenges; communicate status, risks, and proposals and escalate obstacles as needed.
Travel: High travel

Key Requirements

  • •Bachelor’s, Master’s, or PhD in Electrical Engineering, Microelectronics, Physics, Chemistry, Materials Science Engineering, or related field.
  • •2+ years of experience in areas such as Product Integration Test Engineering, Yield Engineering, Design Engineering, or BEOL semiconductor processing/process integration.
  • •Strong knowledge of Semiconductor Device Physics and DRAM product operations, including wafer fabrication process flows and parametric/electrical testing with probe yield.
  • •Strong data analysis, debugging, troubleshooting, and problem-solving skills with attention to detail.
  • •Excellent communication skills and the ability to collaborate across functions and cultures, while managing multiple priorities; travel willingness of ~20–50%.
Experience:SemiconductorsDRAMManufacturing
Education:High School in Electrical Engineering, Microelectronics, Physics, Chemistry, Materials Science Engineering (or related field)
Skills:Technical leadershipData analysisDebuggingCross-functional collaborationCommunication
Tech Stack:Semiconductor Device PhysicsDRAMBEOL semiconductor processingWafer fabrication process flowsParametric/electrical testingProbe yieldMicrosoft Office

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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Glassdoor: 3.7
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