Applied Materials

1 month ago

Packaging SBU Product Line Management IV - (E4)

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 5 hours agoStatus: Live

Job Summary

Own the initiation-to-release program for Applied Materials’ Packaging Service product development within the AGS Packaging SBU. Lead HVP discovery using VOC/FSO inputs, select ROI-based solutions, coordinate beta market opportunity and demonstrations, and drive service readiness across documentation, training, spares readiness, and tool design. Partner across cross-functional teams to develop marketing and field enablement materials, track service revenue vs forecast, and present MPR updates through the phase gate cycle.

Location: Santa Clara

Workplace: Onsite

Employment Type: Full time

Job Function: Communications, PR & Community

Key Responsibilities

•Program manage service product development from initiation through release, including HVP discovery through VOC & FSO.
•Lead solution selection using ROI estimates and drive assessment of market opportunity and beta site selection.
•Chair core team meetings to coordinate internal cross-functional teams and ensure successful beta demonstration with FSO and AGS focal partners.
•Drive service readiness across the product life cycle, including documentation, training, spares readiness, and part/repair readiness.
•Partner with Business Unit and equipment PDP teams to integrate AGS service products, prepare field enablement materials, and present demo/validation summaries to SBU management.

Travel: Medium travel

Pay and Benefits

Salary: USD 147,000 - 202,500 annually

Equity and Bonus:Equity

Key Requirements

•Minimum a Bachelor's Degree, preferably in Chemical, Mechanical, Electrical, Material Science, and/or Data Science.
•7–10 years of semiconductor industry experience (5+ years preferred in Wafer Level Packaging related roles).
•Strong technical knowledge of wafer level packaging semiconductor equipment across hardware design, process engineering, and optimization.
•Proficiency in program management, including leading cross-functional execution through concept to release.
•Strong communication and presentation skills to create and deliver materials for executives and large groups.

Experience:7-10 yearsSemiconductor industryWafer level packagingHardware designProcess engineering

Education:Bachelor's in Chemical, Mechanical, Electrical, Material Science, and/or Data Science

Skills:CommunicationLeadershipProblem-solvingStrategic thinkingStakeholder management

Tech Stack:Microsoft OfficePowerPointExcelSiemens NX

Company Brief

Applied Materials

Provides semiconductor manufacturing equipment, services, and software used to build advanced chips and display technologies. Its tools support materials engineering, deposition, etching, inspection, and process control for major electronics manufacturers worldwide.

Industry: Industrial Machinery

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1967

Glassdoor: 3.9

Website LinkedIn Glassdoor

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Applied Materials

1 month ago

Packaging SBU Product Line Management IV - (E4)

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 5 hours agoStatus: Live

Job Summary

Location: Santa Clara

Workplace: Onsite

Employment Type: Full time

Job Function: Communications, PR & Community

Key Responsibilities

•Program manage service product development from initiation through release, including HVP discovery through VOC & FSO.
•Lead solution selection using ROI estimates and drive assessment of market opportunity and beta site selection.
•Chair core team meetings to coordinate internal cross-functional teams and ensure successful beta demonstration with FSO and AGS focal partners.
•Drive service readiness across the product life cycle, including documentation, training, spares readiness, and part/repair readiness.
•Partner with Business Unit and equipment PDP teams to integrate AGS service products, prepare field enablement materials, and present demo/validation summaries to SBU management.

Travel: Medium travel

Pay and Benefits

Salary: USD 147,000 - 202,500 annually

Equity and Bonus:Equity

Key Requirements

•Minimum a Bachelor's Degree, preferably in Chemical, Mechanical, Electrical, Material Science, and/or Data Science.
•7–10 years of semiconductor industry experience (5+ years preferred in Wafer Level Packaging related roles).
•Strong technical knowledge of wafer level packaging semiconductor equipment across hardware design, process engineering, and optimization.
•Proficiency in program management, including leading cross-functional execution through concept to release.
•Strong communication and presentation skills to create and deliver materials for executives and large groups.

Experience:7-10 yearsSemiconductor industryWafer level packagingHardware designProcess engineering

Education:Bachelor's in Chemical, Mechanical, Electrical, Material Science, and/or Data Science

Skills:CommunicationLeadershipProblem-solvingStrategic thinkingStakeholder management

Tech Stack:Microsoft OfficePowerPointExcelSiemens NX

Company Brief

Applied Materials

Industry: Industrial Machinery

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1967

Glassdoor: 3.9

Website LinkedIn Glassdoor