1 day ago

Module Development Defect Inspection Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 8 hours agoStatus: Live

Job Summary

Drive development of manufacturing and repair/reverse-engineering processes for new semiconductor device architectures. Lead design and optimization of manufacturing process steps, including equipment metrology, parameter tuning, and system design. Conduct feasibility studies using simulations and engineering methods, recommend equipment modifications to improve efficiency and output, and collaborate with cross-functional teams and equipment/material suppliers to deliver future-ready, cost-sensitive technology roadmaps.

Location: United States

Workplace: Onsite

Employment Type: Full time

Job Function: Product Management

Seniority: Mid level

Key Responsibilities

•Drive technology development and enable high-volume manufacturing and future technology through process integration and equipment solutions.
•Lead design and development of advanced manufacturing processes and/or repair reverse engineering, including material selection, parameter optimization, metrology, and system design.
•Perform path-finding activities for process and hardware development and develop technology roadmaps.
•Recommend and implement modifications to operating equipment to improve production efficiency, techniques, and output.
•Partner with equipment and materials suppliers to develop and implement enabling technology elements and conduct feasibility studies using simulations or engineering methods.

Pay and Benefits

Salary: USD 133,800 - 188,890 annually

Perks:Health InsuranceRetirementPaid Leave

Key Requirements

•Bachelor’s degree in a related STEM field (or Master’s with 2+ years, or PhD) with corresponding experience (3+ years for Bachelor’s).
•Experience in semiconductor processing, wafer-level assembly, or cleanroom environments.
•Process development experience using statistical process control and/or manufacturing process improvement.
•Technical expertise in module engineering or fab process/hardware technology development.
•Preferred: strong metrology fundamentals and development experience, plus experience with packaging processes, equipment automation, project management, and data analysis for process optimization.

Experience:3+ yearsSemiconductors

Education:

Skills:CollaborationProcess optimizationFeasibility studiesTechnology developmentRoadmap development

Company Brief

Intel

Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1968

Glassdoor: 3.8

Website LinkedIn Glassdoor

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Intel

1 day ago

Module Development Defect Inspection Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 8 hours agoStatus: Live

Job Summary

Location: United States

Workplace: Onsite

Employment Type: Full time

Job Function: Product Management

Seniority: Mid level

Key Responsibilities

•Drive technology development and enable high-volume manufacturing and future technology through process integration and equipment solutions.
•Lead design and development of advanced manufacturing processes and/or repair reverse engineering, including material selection, parameter optimization, metrology, and system design.
•Perform path-finding activities for process and hardware development and develop technology roadmaps.
•Recommend and implement modifications to operating equipment to improve production efficiency, techniques, and output.
•Partner with equipment and materials suppliers to develop and implement enabling technology elements and conduct feasibility studies using simulations or engineering methods.

Pay and Benefits

Salary: USD 133,800 - 188,890 annually

Perks:Health InsuranceRetirementPaid Leave

Key Requirements

•Bachelor’s degree in a related STEM field (or Master’s with 2+ years, or PhD) with corresponding experience (3+ years for Bachelor’s).
•Experience in semiconductor processing, wafer-level assembly, or cleanroom environments.
•Process development experience using statistical process control and/or manufacturing process improvement.
•Technical expertise in module engineering or fab process/hardware technology development.
•Preferred: strong metrology fundamentals and development experience, plus experience with packaging processes, equipment automation, project management, and data analysis for process optimization.

Experience:3+ yearsSemiconductors

Education:

Skills:CollaborationProcess optimizationFeasibility studiesTechnology developmentRoadmap development

Company Brief

Intel

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1968

Glassdoor: 3.8

Website LinkedIn Glassdoor