Engineer, HIG HBM

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: QA, Test & Release EngineeringEducation: bachelorsSkills: ["Problem-solving","Attention to detail","Team collaboration","Communication","Ownership"]

Develop and execute reliability stress test flows, plans, and qualification gating for HBM product reliability. Partner with the global quality team to track qualification execution, resolve gating issues, and reduce extrinsic and intrinsic reliability metrics (e.g., DPM). Lead root-cause investigations for qualifying and RMA device issues using EFA/PFA, recommend fab process conversions to improve yield and cost, and manage DPM/process-conversion risk with product leadership through cross-functional collaboration.

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FursaFursa
Micron Technology
Micron Technology
1 month ago

Engineer, HIG HBM

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Last checked: 21 hours agoStatus: Live

Job Summary

Develop and execute reliability stress test flows, plans, and qualification gating for HBM product reliability. Partner with the global quality team to track qualification execution, resolve gating issues, and reduce extrinsic and intrinsic reliability metrics (e.g., DPM). Lead root-cause investigations for qualifying and RMA device issues using EFA/PFA, recommend fab process conversions to improve yield and cost, and manage DPM/process-conversion risk with product leadership through cross-functional collaboration.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: QA, Test & Release Engineering

Key Responsibilities

  • •Define and develop reliability stress test flows, test plans, and coverage for product reliability aspects.
  • •Partner with the global quality team to define qualification plans, track execution progress, and drive qualification gating issue resolution.
  • •Drive reductions in extrinsic and intrinsic reliability metrics (Time 0 and Field DPM) through optimized manufacturing test flows and test strategy to meet KPI targets.
  • •Debug and identify root causes for qualified and RMA device issues using electric failure analysis (EFA) and physical failure analysis (PFA), coordinating cross-functional resolution and improvements.
  • •Recommend fab process conversions to reduce cost, increase yields, and manage associated DPM process-conversion risks through communication with product stakeholders.

Key Requirements

  • •Bachelor’s or Master’s degree in Electrical and Electronics Engineering (or related field).
  • •Understanding of problem-solving methodologies focused on identifying root causes and solution spaces.
  • •Familiarity with CMOS technology, DRAM architecture, and basic device physics.
  • •Exposure to data analysis, statistics, and scripting tools such as Python or JMP.
  • •Effective team collaboration and clear communication in written and spoken English, with strong attention to detail and quality ownership.
Experience:Semiconductor devicesCircuit designProduct validation
Education:Bachelor's in Electrical and Electronics Engineering
Skills:Problem-solvingAttention to detailTeam collaborationCommunicationOwnership
Languages:English
Tech Stack:PythonJMPCMOSDRAMCircuit designSemiconductor devicesStatistical analysisData analysis

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
Glassdoor
Glassdoor: 3.7
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