NVIDIA

1 week ago

Senior IC Packaging Development Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 23 hours agoStatus: Live

Job Summary

Lead the development of rapid IC packaging for individual die to support Failure Analysis and NPI ahead of high-volume manufacturing. Drive mechanical, thermal, and material evaluations of next-generation packages, manage rapid prototyping and package stack-ups, and pioneer die-level processing methodologies. Coordinate physical and electrical failure analysis to determine root causes, while collaborating across IC failure analysis, design, process/product engineering, and external foundries/OSAT partners to establish packaging processes, tooling, and workflows.

Location: Santa Clara

Workplace: Onsite

Employment Type: Full time

Job Function: Solutions Engineering & Sales Engineering

Seniority: Mid level

Key Responsibilities

•Drive process, mechanical, thermal, and material evaluation of the latest IC packages, including rapid prototyping builds, package stack-ups, and assembly processes for FA and NPI use cases.
•Evaluate innovative packaging materials (e.g., molding compounds, substrates, adhesives) and develop die-level processing methodologies.
•Coordinate physical and electrical failure analysis on prototype builds and reliability-tested components to determine root causes.
•Collaborate with IC and package design, process and product engineering teams, and work with foundries and OSAT partners to develop and test required processes, tooling, and workflows.

Pay and Benefits

Salary: USD 168,000 - 270,250 annually

Equity and Bonus:Equity

Key Requirements

•B.S., M.S., or Ph.D., or equivalent experience in Materials Science, Mechanical Engineering, Electrical Engineering, Physics, or a related semiconductor field.
•Deep understanding of flip-chip, 2.5D/3D packaging, wire bonding, and advanced substrate architectures.
•12+ years of hands-on experience in IC packaging development and/or package design, including NPI (New Product Introduction).
•Familiarity with IC package EDA software (e.g., Cadence Allegro Package Designer) and finite element modeling (FEM) tools such as ANSYS or ABAQUS.
•Basic understanding of advanced packaging-related FA techniques and equipment (e.g., SEM, EDX, CSAM, X-Ray, LIT).

Experience:12+ yearsSemiconductorIC packagingNPIFailure analysis

Education:

Skills:CollaborationAutonomyCreativity

Tech Stack:Cadence Allegro Package DesignerFinite Element Modeling (FEM)ANSYSABAQUSSEMEDXCSAMX-RayLIT

Company Brief

NVIDIA

Designs and manufactures GPUs, AI accelerators, and system-on-chip products for gaming, data centers, professional visualization, and automotive markets, enabling advanced graphics, AI, and high-performance computing solutions worldwide.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1993

Glassdoor: 4.3

Website LinkedIn Glassdoor

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NVIDIA

1 week ago

Senior IC Packaging Development Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 23 hours agoStatus: Live

Job Summary

Location: Santa Clara

Workplace: Onsite

Employment Type: Full time

Job Function: Solutions Engineering & Sales Engineering

Seniority: Mid level

Key Responsibilities

•Drive process, mechanical, thermal, and material evaluation of the latest IC packages, including rapid prototyping builds, package stack-ups, and assembly processes for FA and NPI use cases.
•Evaluate innovative packaging materials (e.g., molding compounds, substrates, adhesives) and develop die-level processing methodologies.
•Coordinate physical and electrical failure analysis on prototype builds and reliability-tested components to determine root causes.
•Collaborate with IC and package design, process and product engineering teams, and work with foundries and OSAT partners to develop and test required processes, tooling, and workflows.

Pay and Benefits

Salary: USD 168,000 - 270,250 annually

Equity and Bonus:Equity

Key Requirements

•B.S., M.S., or Ph.D., or equivalent experience in Materials Science, Mechanical Engineering, Electrical Engineering, Physics, or a related semiconductor field.
•Deep understanding of flip-chip, 2.5D/3D packaging, wire bonding, and advanced substrate architectures.
•12+ years of hands-on experience in IC packaging development and/or package design, including NPI (New Product Introduction).
•Familiarity with IC package EDA software (e.g., Cadence Allegro Package Designer) and finite element modeling (FEM) tools such as ANSYS or ABAQUS.
•Basic understanding of advanced packaging-related FA techniques and equipment (e.g., SEM, EDX, CSAM, X-Ray, LIT).

Experience:12+ yearsSemiconductorIC packagingNPIFailure analysis

Education:

Skills:CollaborationAutonomyCreativity

Tech Stack:Cadence Allegro Package DesignerFinite Element Modeling (FEM)ANSYSABAQUSSEMEDXCSAMX-RayLIT

Company Brief

NVIDIA

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1993

Glassdoor: 4.3

Website LinkedIn Glassdoor