Principal Memory Design Engineer, HBM

Micron Technology
Texas
Workplace: OnsiteFull timeFunction: Design (Product/UX/UI/Visual)Education: bachelorsSkills: ["Technical problem-solving","Communication","Leadership"]

Architect and deliver high-performance DRAM circuit compositions for advanced technology nodes, driving innovation across building, layout, verification, and silicon validation. Optimize digital, analog, and memory-core subsystems to meet power, performance, reliability, and time-to-market goals. Lead floorplanning and simulation-to-silicon correlation using FINESIM, HSPICE, and VERILOG, coordinate layout/build resources, and serve as a technical interface across design, verification, test, and technology teams.

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FursaFursa
Micron Technology
Micron Technology
17 hours ago

Principal Memory Design Engineer, HBM

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Last checked: 6 hours agoStatus: Live

Job Summary

Architect and deliver high-performance DRAM circuit compositions for advanced technology nodes, driving innovation across building, layout, verification, and silicon validation. Optimize digital, analog, and memory-core subsystems to meet power, performance, reliability, and time-to-market goals. Lead floorplanning and simulation-to-silicon correlation using FINESIM, HSPICE, and VERILOG, coordinate layout/build resources, and serve as a technical interface across design, verification, test, and technology teams.
Location: Texas
Workplace: Onsite
Employment Type: Full time
Job Function: Design (Product/UX/UI/Visual)

Key Responsibilities

  • •Design and optimize DRAM circuits across digital, analog, and memory-core subsystems to meet power, performance, and reliability targets.
  • •Develop and refine floorplans, routing strategies, power delivery networks, sense margins, timings, and die-size tradeoffs.
  • •Perform advanced circuit simulations with FINESIM, HSPICE, and VERILOG and analyze speed, power, noise, and long-term reliability.
  • •Model parasitics, verify power and signal integrity, and support validation, reticle experiments, and tape-out revisions.
  • •Lead technical reviews, documentation, standardization, and coordinate layout/build resources while communicating project status and risks.

Pay and Benefits

Perks:Health InsuranceDentalVisionPaid Time-offPaid LeavePaid HolidaysEquity

Key Requirements

  • •BS in Electrical Engineering (or related) or equivalent experience with advanced coursework in CMOS circuit building, VLSI, and analog circuits.
  • •Hands-on expertise with Cadence Virtuoso, physical layout, and circuit floorplanning.
  • •Experience using FINESIM, HSPICE, and VERILOG for complex circuit simulation and analysis.
  • •Ability to solve ambitious technical problems with significant design or innovation impact.
  • •Deep knowledge of DRAM subsystem architecture/operation/building, with experience leading multi-functional technical efforts.
Experience:SemiconductorsMemory technologyDRAM
Education:Bachelor's in Electrical Engineering
Skills:Technical problem-solvingCommunicationLeadership
Tech Stack:DRAMHBMCadence VirtuosoPhysical layoutFloorplanningFINESIMHSPICEVerilogCMOSVLSIAnalog circuitsPower delivery networksSignal integrityReticle experimentsTape-out

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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