Module Engineering - Day Shift 5 or 7

Intel
United States
Workplace: OnsiteFull timeUSD 85,200 - 162,500 annuallyFunction: Industrial, Process & Manufacturing EngineeringExperience: 1+ yearsSkills: ["Continuous improvement","Data analysis","Problem solving"]

Develop and optimize semiconductor foundry packaging assembly processes and equipment in Intel’s Foundry Technology Manufacturing organization. You’ll improve manufacturing efficiency and package quality, reliability, yield, and cost by defining process specifications using Design of Experiments (DOE) and data analysis. The role includes building/testing equipment for silicon and package evaluations, creating reliability screening and quality tools, and supporting foundry customers and partner teams with process improvement guidance.

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Intel
Intel
1 month ago

Module Engineering - Day Shift 5 or 7

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Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 7 hours agoStatus: Live
Reposted: similar role first listed 1 month ago

Job Summary

Develop and optimize semiconductor foundry packaging assembly processes and equipment in Intel’s Foundry Technology Manufacturing organization. You’ll improve manufacturing efficiency and package quality, reliability, yield, and cost by defining process specifications using Design of Experiments (DOE) and data analysis. The role includes building/testing equipment for silicon and package evaluations, creating reliability screening and quality tools, and supporting foundry customers and partner teams with process improvement guidance.
Location: United States
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering
Seniority: Entry level

Key Responsibilities

  • •Design and develop assembly processes and equipment to advance the foundry packaging roadmap and platform technologies.
  • •Optimize manufacturing efficiency while meeting quality, reliability, cost, yield, productivity, and manufacturability requirements.
  • •Define process and equipment specifications using DOE and data analysis, and document improvements via technical white papers.
  • •Develop and maintain equipment to evaluate silicon and package technologies under simulated field conditions (e.g., thermal cycling, heat, humidity, mechanical stress).
  • •Ensure packages are manufacturable within foundry process flows and oversee full-cycle manufacturing processes and reliability screening methods.

Pay and Benefits

Salary: USD 85,200 - 162,500 annually
Perks:Health InsuranceRetirementPaid Leave

Key Requirements

  • •US Citizenship required.
  • •Bachelor's degree with 1+ years of experience in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or a STEM-related field.
  • •OR Master's degree in one of the listed engineering fields or a STEM-related field.
  • •OR Associate degree with 12+ years of engineering-role experience in one of the listed fields.
  • •6+ months of experience with Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles.
Experience:1+ yearsSemiconductor manufacturingFoundryTechnology manufacturing
Skills:Continuous improvementData analysisProblem solving
Tech Stack:Design of Experiments (DOE)Statistical Process Control (SPC)Data analysisTechnical white papersThermal cyclingDynamic mechanical stress testing

Eligibility

Nationality:US National

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
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Glassdoor: 3.8
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