Module Engineering - Day Shift 5 or 7

Develop and optimize semiconductor foundry packaging assembly processes and equipment in Intel’s Foundry Technology Manufacturing organization. You’ll improve manufacturing efficiency and package quality, reliability, yield, and cost by defining process specifications using Design of Experiments (DOE) and data analysis. The role includes building/testing equipment for silicon and package evaluations, creating reliability screening and quality tools, and supporting foundry customers and partner teams with process improvement guidance.