Senior Substrate Engineer

AMD
Tokyo
Workplace: HybridFull timeJPY 9,590,000 - 13,700,000 annuallyFunction: Solutions Engineering & Sales EngineeringEducation: mastersSkills: ["Communication","Cross-functional collaboration","Process development","Technical problem-solving"]

Lead technology development and substrate bring-up to support AMD’s product roadmap. Define substrate and board technology roadmaps across pitch scaling, power delivery, signal integrity, and cost. Partner with architects, designers, and product owners to deliver high-yield, cost-effective substrate solutions, select and work with development partners, and coordinate with product, quality, and manufacturing teams to achieve manufacturability, yield, and reliability from concept through NPI. Qualify substrate for new products meeting cost and yield targets.

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FursaFursa
AMD
AMD
2 days ago

Senior Substrate Engineer

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Source: Company careers pageValidated by: Fursa AI
Last checked: 5 hours agoStatus: Live

Job Summary

Lead technology development and substrate bring-up to support AMD’s product roadmap. Define substrate and board technology roadmaps across pitch scaling, power delivery, signal integrity, and cost. Partner with architects, designers, and product owners to deliver high-yield, cost-effective substrate solutions, select and work with development partners, and coordinate with product, quality, and manufacturing teams to achieve manufacturability, yield, and reliability from concept through NPI. Qualify substrate for new products meeting cost and yield targets.
Location: Tokyo
Workplace: Hybrid
Employment Type: Full time
Job Function: Solutions Engineering & Sales Engineering
Seniority: Mid level

Key Responsibilities

  • •Lead technology development and supply chain bring-up of advanced substrate technologies to support the product roadmap.
  • •Define the advanced substrate and board technology roadmap across pitch scaling, power delivery, signal integrity, and cost.
  • •Partner with architects, designers, and product owners to define high-yield, cost-effective substrate solutions meeting product requirements.
  • •Select development partners to bring into the AMD supply chain to enable substrate and PCB technology building blocks.
  • •Partner with product, quality, and manufacturing engineering teams to meet milestones for manufacturability, yield, and reliability through NPI and qualify package substrates for new products.

Pay and Benefits

Salary: JPY 9,590,000 - 13,700,000 annually

Key Requirements

  • •Proven track record developing advanced packaging technologies at a substrate supplier, OSAT, or fabless/IDM, including identifying and enabling new substrates.
  • •Hands-on process development experience with deep knowledge of packaging and board design rules, process flows, and materials.
  • •Excellent oral and written communication to align technology targets and requirements with suppliers, internal partners, product architects, and AMD management.
  • •Depth of experience leading cross-functional teams to drive technology certification and yield/cost reduction initiatives.
  • •BS/MS/PhD in solid state physics, chemistry, material science, chemical engineering, or an equivalent field.
Experience:SemiconductorsAdvanced packagingSubstrate technologyNPI
Education:Master's in solid state physics, Chemistry, Material science, Chemical engineering
Skills:CommunicationCross-functional collaborationProcess developmentTechnical problem-solving
Languages:English
Tech Stack:Solid state physicsMaterials scienceBoard design

Company Brief

AMD
Designs and produces semiconductor products including CPUs, GPUs, and adaptive SoCs for consumer, enterprise, and embedded markets, competing across PCs, data centers, and gaming industries.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1969
Glassdoor
Glassdoor: 3.9
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