HVM PEE Dry Etch MTS/SMTS

Micron Technology
Taiwan
Workplace: OnsiteFull timeFunction: Industrial, Process & Manufacturing EngineeringExperience: 10+ yearsEducation: mastersSkills: ["Technical leadership","Analytical thinking","Problem-solving","Communication","Cross-functional collaboration"]

Lead development, characterization, and optimization of Dry Etch processes for advanced DRAM structures, driving yield improvement and process robustness. Collaborate with integration, metrology, equipment, and R&D teams to define and execute technical roadmaps and continuously improve etch-related issues. Evaluate new etch technologies, chemistries, and hardware platforms, work with equipment vendors, mentor junior engineers, and present findings to global stakeholders.

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Micron Technology
Micron Technology
4 months ago

HVM PEE Dry Etch MTS/SMTS

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Last checked: 7 hours agoStatus: Live

Job Summary

Lead development, characterization, and optimization of Dry Etch processes for advanced DRAM structures, driving yield improvement and process robustness. Collaborate with integration, metrology, equipment, and R&D teams to define and execute technical roadmaps and continuously improve etch-related issues. Evaluate new etch technologies, chemistries, and hardware platforms, work with equipment vendors, mentor junior engineers, and present findings to global stakeholders.
Location: Taiwan
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering
Seniority: Mid level

Key Responsibilities

  • •Lead development, characterization, and optimization of Dry Etch processes for advanced DRAM structures.
  • •Collaborate cross-functionally with integration, metrology, equipment, and R&D teams to ensure process robustness and manufacturability.
  • •Define and execute technical roadmaps aligned with DRAM scaling requirements and yield improvement goals.
  • •Evaluate and implement new etch technologies, chemistries, and hardware platforms.
  • •Drive root cause analysis and continuous improvement for process-related issues, mentor junior engineers, and present findings to executive leadership and global teams.

Key Requirements

  • •Ph.D. or Master’s degree in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related fields.
  • •Minimum 10 years of hands-on Dry Etch process development experience, preferably for DRAM or advanced memory technologies.
  • •Proven technical leadership in semiconductor process engineering.
  • •Deep understanding of plasma etch mechanisms, process control, and defect mitigation.
  • •Experience with advanced etch tools (e.g., Lam, TEL, AMAT) and process characterization techniques.
Experience:10+ yearsSemiconductorDRAMAdvanced memoryDry etch
Education:Master's in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field
Skills:Technical leadershipAnalytical thinkingProblem-solvingCommunicationCross-functional collaboration
Tech Stack:Dry EtchDRAMPlasma etchProcess controlDefect mitigationLamTELAMATSPCDOE

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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Glassdoor: 3.7
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