Quantum IC Package Substrate Design Engineer

Intel
United States
Workplace: OnsiteFull timeUSD 122,440 - 172,860 annuallyFunction: Design (Product/UX/UI/Visual)Experience: 3+ yearsSkills: ["Communication","Presentation","Analytical thinking","Problem-solving","Collaboration"]

Design large form-factor IC substrates for Intel’s quantum computing team, using Siemens Xpedition and advanced packaging integration (2.5D/3D). You’ll translate stakeholder feedback from silicon testchips and validate designs with DRC/LVS and signal/power/thermal considerations, collaborate with substrate suppliers on tapeouts, and communicate milestones through documentation and presentations while staying current with packaging advances.

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Intel
Intel
1 day ago

Quantum IC Package Substrate Design Engineer

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Last checked: 4 hours agoStatus: Live

Job Summary

Design large form-factor IC substrates for Intel’s quantum computing team, using Siemens Xpedition and advanced packaging integration (2.5D/3D). You’ll translate stakeholder feedback from silicon testchips and validate designs with DRC/LVS and signal/power/thermal considerations, collaborate with substrate suppliers on tapeouts, and communicate milestones through documentation and presentations while staying current with packaging advances.
Location: United States
Workplace: Onsite
Employment Type: Full time
Job Function: Design (Product/UX/UI/Visual)

Key Responsibilities

  • •Design IC substrates using Siemens Xpedition IC package design software.
  • •Collaborate with stakeholders to meet design requirements using feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration teams.
  • •Perform design validation and verification, including DRC and LVS.
  • •Integrate advanced packaging designs (2.5D and 3D) with IC substrates and support tapeout collaboration with substrate suppliers.
  • •Deliver design milestones and communicate designs via presentations and relevant documentation while staying current with packaging technology.

Pay and Benefits

Salary: USD 122,440 - 172,860 annually
Equity and Bonus:Equity
Perks:Health InsuranceRetirementPaid Leave

Key Requirements

  • •B.S. in Electrical Engineering, Computer Engineering, or related field with 5+ years of IC substrate design experience, or M.S. with 3+ years.
  • •Experience designing IC substrates for CPU, GPU, SoC/ASIC, and/or relevant design architectures.
  • •Hands-on use of the Siemens Xpedition design environment and workflow.
  • •Experience with high-speed signal routing and large form factor IC substrates.
  • •Familiarity with SI/PI/thermal impacts on IC substrate design choices (preferred).
Experience:3+ yearsIC substrate designAdvanced packaging
Education:
Skills:CommunicationPresentationAnalytical thinkingProblem-solvingCollaboration
Tech Stack:Siemens XpeditionAIPhysics/model-based routing

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
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