Mechanical Engineer || || Creo, UG NX || Electronics Packaging || Chassi Design || Enclosure Design || Exp : 8+ years

Cisco
Bengaluru
Workplace: HybridFull timeFunction: Design (Product/UX/UI/Visual)Experience: 7+ yearsSkills: ["Collaboration","Technical excellence"]

Design and lead electro-mechanical packaging development for telecom systems, bridging early architecture concepts to production. Use CREO to create complex chassis and enclosure designs, perform feasibility and tolerance studies, and drive medium-scale projects. Ensure reliability through thermal and structural analysis (FEA/CFD), collaborate with DVT teams to resolve issues, and apply DFM/DFA plus FMEA to improve manufacturing quality, fixtures, and assembly processes while meeting cost and RAS goals.

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FursaFursa
Cisco
Cisco
6 hours ago

Mechanical Engineer || || Creo, UG NX || Electronics Packaging || Chassi Design || Enclosure Design || Exp : 8+ years

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Source: Company careers pageValidated by: Fursa AI
Last checked: 6 hours agoStatus: Live

Job Summary

Design and lead electro-mechanical packaging development for telecom systems, bridging early architecture concepts to production. Use CREO to create complex chassis and enclosure designs, perform feasibility and tolerance studies, and drive medium-scale projects. Ensure reliability through thermal and structural analysis (FEA/CFD), collaborate with DVT teams to resolve issues, and apply DFM/DFA plus FMEA to improve manufacturing quality, fixtures, and assembly processes while meeting cost and RAS goals.
Location: Bengaluru
Workplace: Hybrid
Employment Type: Full time
Job Function: Design (Product/UX/UI/Visual)
Seniority: Mid level

Key Responsibilities

  • •Use CREO to design complex electro-mechanical packaging for telecom systems, including feasibility, prototyping, and system-level tolerance studies
  • •Lead medium-scale mechanical engineering projects from concept to production while managing risks and resource requirements
  • •Perform thermal and structural analysis (FEA/Stress testing) and work with DVT teams to identify and debug design issues
  • •Apply Design for Manufacturing (DFM) and Design for Assembly (DFA) standards, including fixture design and assembly process improvements using FMEA
  • •Set BoM standards, select materials, and perform cost model analysis to meet COGS targets while aligning with RAS goals

Key Requirements

  • •Bachelor’s degree with 10+ years of related experience, or Master’s degree with 7+ years of related experience
  • •Advanced proficiency in CREO for complex chassis and enclosure design
  • •Strong background in thermal management for high-performance telecom equipment
  • •Proven experience in high-volume manufacturing environments
  • •Expertise in simulation tools (FEA/CFD) for structural and thermal integrity
Experience:7+ yearsTelecomHigh-volume manufacturing
Skills:CollaborationTechnical excellence
Tech Stack:CreoUG NXFEACFDDFMDFAFMEABoMDVT

Company Brief

Cisco
Global technology company that designs, manufactures, and sells networking hardware, telecommunications equipment, and high-technology services and products for enterprises, service providers, and governments worldwide.
Industry: Networking Equipment
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: San Jose, United States
Founded: 1984
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