Staff Engineer, Advanced Packaging Technology Development

Micron Technology
Taiwan
Workplace: OnsiteFull timeFunction: Product ManagementExperience: 5+ yearsEducation: bachelorsSkills: ["Collaboration","Technical leadership","Problem-solving","Innovation","Mentorship"]

Lead and advance semiconductor advanced packaging technology by delivering differentiated solutions, driving technical innovation, and coordinating multi-disciplinary teams. Partner with internal and external stakeholders to enable flawless technology integration, develop packaging technology roadmaps, and analyze competitive trends using data and AI-supported analysis. Apply deep expertise in advanced packaging (including Hybrid bonding, 2.5D/3D integration, wafer-level packaging, and DRAM processes) to troubleshoot complex issues, improve efficiency and quality, and contribute to patents and technical communications.

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FursaFursa
Micron Technology
Micron Technology
2 weeks ago

Staff Engineer, Advanced Packaging Technology Development

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Job Summary

Lead and advance semiconductor advanced packaging technology by delivering differentiated solutions, driving technical innovation, and coordinating multi-disciplinary teams. Partner with internal and external stakeholders to enable flawless technology integration, develop packaging technology roadmaps, and analyze competitive trends using data and AI-supported analysis. Apply deep expertise in advanced packaging (including Hybrid bonding, 2.5D/3D integration, wafer-level packaging, and DRAM processes) to troubleshoot complex issues, improve efficiency and quality, and contribute to patents and technical communications.
Location: Taiwan
Workplace: Onsite
Employment Type: Full time
Job Function: Product Management
Seniority: Mid level

Key Responsibilities

  • •Deliver differentiated advanced packaging technology solutions and drive technical innovation that provides business value.
  • •Lead multi-disciplinary technical teams and task forces to achieve strategic goals, including defining requirements with proven technical data.
  • •Direct creation of packaging technology roadmaps and analyze competitive trends using data intelligence and AI-supported analysis.
  • •Identify and implement opportunities to improve engineering efficiency through AI-assisted workflows, automation, and knowledge management.
  • •Troubleshoot sophisticated technical issues, mentor for resolution, and contribute to patents, trade secrets, technical presentations, and papers.

Key Requirements

  • •Over 5 years of professional experience in semiconductor advanced packaging.
  • •BS, MS, or Ph.D. in Material Science, Electrical, Chemical, Mechanical Engineering, Physics, or a related field (or equivalent experience).
  • •Deep knowledge of High Bandwidth Memory and advanced 2.5D/3D integration strategies, including Hybrid bonding.
  • •Hands-on process module engineering experience in Wafer Level Packaging or 3D stacking process.
  • •Experience in DRAM manufacturing and OSAT companies.
Experience:5+ yearsSemiconductorAdvanced packagingDRAM manufacturingOSAT
Education:Bachelor's in Material Science, Electrical, Chemical, Mechanical Engineering, Physics (or related field)
Skills:CollaborationTechnical leadershipProblem-solvingInnovationMentorship
Languages:English
Tech Stack:AI-enabled engineering toolsData analyticsWorkflow automationKnowledge managementTechnical documentation generationResponsible AIData governanceHigh Bandwidth Memory2.5D integration3D integrationHybrid bondingWafer Level Packaging3D stackingWafer process flows

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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