Engineering Execution Manager, HIG High Bandwidth Memory (HBM)

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Program & Project Management (PMO)Experience: 5+ yearsEducation: bachelorsSkills: ["Communication","Leadership","Presentation skills","Risk identification","Data analysis"]

Lead cross-functional execution for HBM product development from concept through design, NPI, and HVM in Micron’s HIG organization. Own and drive detailed development schedules, identify issues, analyze risks, prioritize milestones, and coordinate resources with Technology Development, Design, Process, APTD, PE, and Manufacturing teams. Provide regular status communication, manage product documentation and task ownership, and support hardware readiness and capacity planning.

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FursaFursa
Micron Technology
Micron Technology
1 week ago

Engineering Execution Manager, HIG High Bandwidth Memory (HBM)

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Source: Company careers pageValidated by: Fursa AI
Last checked: 57 minutes agoStatus: Live
Reposted: similar role first listed 5 months ago

Job Summary

Lead cross-functional execution for HBM product development from concept through design, NPI, and HVM in Micron’s HIG organization. Own and drive detailed development schedules, identify issues, analyze risks, prioritize milestones, and coordinate resources with Technology Development, Design, Process, APTD, PE, and Manufacturing teams. Provide regular status communication, manage product documentation and task ownership, and support hardware readiness and capacity planning.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Program & Project Management (PMO)
Seniority: Manager level

Key Responsibilities

  • •Guide HBM product execution through concept, design, NPI, and HVM by facilitating cross-functional lifecycle management.
  • •Build and maintain detailed development schedules and drive tactical execution from pre-silicon to HVM.
  • •Define and prioritize projects and milestones; identify and analyze issues, risks, and required resources to meet deliverables.
  • •Integrate HBM development across extended HIG, TPG teams, and partner organizations; coordinate with Technology Development, Design, Process, APTD, PE, and Manufacturing teams.
  • •Serve as product point of contact for task/documentation coverage and provide inputs for hardware readiness and capacity planning.

Key Requirements

  • •Bachelor’s or Master’s degree in Electrical or Computer Engineering or manufacturing/supply chain related fields.
  • •5+ years of relevant technical/manufacturing experience driving cross-functional teams.
  • •Excellent written and verbal communication for technical and senior management audiences.
  • •Comfortable with data analysis methods and data visualization to communicate data-backed conclusions.
  • •Familiarity with JIRA and Confluence and other project management tools.
Experience:5+ yearsManufacturingCross-functional teams
Education:Bachelor's in Electrical Engineering or Computer Engineering (or manufacturing/supply chain related fields)
Skills:CommunicationLeadershipPresentation skillsRisk identificationData analysis
Tech Stack:JIRAConfluence

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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