Integrated Circuit - Packaging Architect Engineer
AMD
Austin
Workplace: HybridFull timeFunction: Solutions Engineering & Sales EngineeringEducation: mastersSkills: ["Leadership","Communication","Cross-functional collaboration","Problem-solving"]Lead advanced packaging architecture across AMD’s client, server, gaming, and GPU products. Define packaging roadmaps with DF M/DFY guidelines, drive technology development from concept to qualifications, lead cross-functional teams across geos, and communicate progress to AMD management while addressing yield and reliability challenges.

