Senior Technician - Package Dev

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Field Service, Maintenance & Skilled TradesExperience: 2-5 yearsEducation: certificationSkills: ["Sound judgment","Continuous improvement","Teamwork","Self-discipline","Willingness to learn"]

Perform independent lab analysis to support IC package development, including die/package materials characterization and physical failure analysis. Use tools such as scanning acoustic microscopy, X-ray, SEM, and FIB cross-sectioning to support silicon technology and package development. Support lab materials/chemicals supply, tool maintenance and calibration, and maintain lab housekeeping to meet 6S cleanliness standards. Apply AI-assisted tools and insights to improve efficiency and quality while continuously learning and supporting team needs.

Loading

Loading job details...

Preparing the role view and application actions.

FursaFursa
Micron Technology
Micron Technology
2 weeks ago

Senior Technician - Package Dev

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 23 hours agoStatus: Live

Job Summary

Perform independent lab analysis to support IC package development, including die/package materials characterization and physical failure analysis. Use tools such as scanning acoustic microscopy, X-ray, SEM, and FIB cross-sectioning to support silicon technology and package development. Support lab materials/chemicals supply, tool maintenance and calibration, and maintain lab housekeeping to meet 6S cleanliness standards. Apply AI-assisted tools and insights to improve efficiency and quality while continuously learning and supporting team needs.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Field Service, Maintenance & Skilled Trades
Seniority: Mid level

Key Responsibilities

  • •Perform die/package materials characterization and physical failure analysis (PFA) to support IC package and technology development.
  • •Run lab analysis using instruments such as SAM, X-ray, cross section, SEM, and FIB cross-sectioning to support silicon technology and packaging development.
  • •Support lab materials/chemicals supply and administration activities.
  • •Maintain lab tools including maintenance and calibration.
  • •Maintain lab housekeeping to meet the site lab 6S cleanliness standard, and integrate AI-assisted tools into daily work to improve efficiency and quality.

Key Requirements

  • •Graduated with a Diploma in Mechanical Engineering, Chemical Process/Engineering, or Materials Science/Engineering.
  • •At least 2-5 years of lab analysis experience in semiconductor industries or materials science/engineering industries.
  • •Ability to perform die/package materials characterization and physical failure analysis to support IC package and technology development.
  • •Experience using lab analysis methods and instruments such as SAM, X-ray, cross sections, SEM, and FIB.
  • •Willingness to work overtime with minimum supervision and strong self-discipline.
Experience:2-5 yearsSemiconductor industriesMaterials science engineering
Education:Certification / Diploma in Mechanical Engineering / Chemical Process/Engineering / Materials Science/Engineering
Skills:Sound judgmentContinuous improvementTeamworkSelf-disciplineWillingness to learn
Tech Stack:Scanning Acoustic Microscope (SAM)X-rayScanning Electron Microscope (SEM)Focused-Ion-Beam (FIB)Cross sectioningAI-assisted tools

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
Glassdoor
Glassdoor: 3.7
WebsiteLinkedIn