Dry Etch - MTS, PD, Advance NAND

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Industrial, Process & Manufacturing EngineeringEducation: phdSkills: ["Leadership","Problem-solving","Collaboration","Technical leadership","Presentation"]

Join Micron’s Next Generation NAND R&D Dry Etch team as an MTS to lead dry etch technology development for advanced NAND. You’ll operate dry etch chambers, manage the process roadmap, and become an area expert in plasma dry etch fundamentals and deep high aspect ratio etch scalability. Partner with hardware and other process teams, present plans for upcoming nodes, and provide technical updates while mentoring less-experienced engineers.

Loading

Loading job details...

Preparing the role view and application actions.

FursaFursa
Micron Technology
Micron Technology
4 months ago

Dry Etch - MTS, PD, Advance NAND

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 14 hours agoStatus: Live

Job Summary

Join Micron’s Next Generation NAND R&D Dry Etch team as an MTS to lead dry etch technology development for advanced NAND. You’ll operate dry etch chambers, manage the process roadmap, and become an area expert in plasma dry etch fundamentals and deep high aspect ratio etch scalability. Partner with hardware and other process teams, present plans for upcoming nodes, and provide technical updates while mentoring less-experienced engineers.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering
Seniority: Mid level

Key Responsibilities

  • •Lead development of Dry Etch technology and essential modules for advanced NAND.
  • •Develop and innovate dry etch processes to meet structural and electrical specifications.
  • •Operate dry etch chambers and manage the process roadmap to achieve program and yield goals.
  • •Collaborate with process and hardware teams to build equipment roadmaps and solve complex structural issues.
  • •Present technology development plans for current and upcoming nodes and mentor less-experienced engineers.

Key Requirements

  • •6–10 years of experience in dry etch process development in R&D moving into manufacturing.
  • •4–5 years of pertinent experience in NAND, DRAM, or Logic module development involving multi-functional group projects and deliveries.
  • •Knowledge of plasma physics/plasma chemistry/transport/surface phenomena from experience and/or coursework.
  • •Demonstrated leadership in problem-solving and experience managing technical projects.
  • •PhD (or equivalent) in a relevant field (Chemical, Mechanical, Electrical, Material Science, Physics, Chemical Physics, Chemistry, Semiconductor Engineering, or related), or Bachelors/Masters with minimum applicable dry etch experience.
Experience:Research and developmentSemiconductor manufacturingNANDDRAMPlasma processing
Education:PhD / Doctorate in Chemical, Mechanical, Electrical, Material Science, Physics, Chemical Physics, Chemistry, Semiconductor Engineering, or related fields
Skills:LeadershipProblem-solvingCollaborationTechnical leadershipPresentation
Tech Stack:Dry etchPlasma physicsPlasma chemistryMS OfficeSASJmPPythonAI

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
Glassdoor
Glassdoor: 3.7
WebsiteLinkedIn