Advanced Packaging Inspection (Mantis-D) Process Support Engineer

Applied Materials
South Korea
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityExperience: 6+ yearsSkills: ["Technical mentorship","Presentations","Negotiation","Customer engagement","Root cause analysis","Problem-solving","Cross-functional collaboration"]

Serve as a customer-facing Process Support Engineer, guiding advanced semiconductor packaging inspection systems through installation, diagnosis, service, and qualification. Partner with customers and R&D to develop and validate inspection process experiments and design of experiments (DOEs), troubleshoot complex issues, and perform root cause analyses. Lead Kinex Mantis-D Integrated Module Inspection applications for HBM, 2.5D/3D, hybrid bonding, and chiplet integration, transferring application capabilities to regional support teams.

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Applied Materials
Applied Materials
1 day ago

Advanced Packaging Inspection (Mantis-D) Process Support Engineer

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Source: Company careers pageValidated by: Fursa AI
Last checked: 57 minutes agoStatus: Live

Job Summary

Serve as a customer-facing Process Support Engineer, guiding advanced semiconductor packaging inspection systems through installation, diagnosis, service, and qualification. Partner with customers and R&D to develop and validate inspection process experiments and design of experiments (DOEs), troubleshoot complex issues, and perform root cause analyses. Lead Kinex Mantis-D Integrated Module Inspection applications for HBM, 2.5D/3D, hybrid bonding, and chiplet integration, transferring application capabilities to regional support teams.
Location: South Korea
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Develop deep expertise in semiconductor advanced packaging processes and customer manufacturing flows to identify inspection challenges, technology gaps, and yield improvement opportunities.
  • •Serve as the technical lead for Kinex Mantis-D Integrated Module Inspection systems, including advanced macro optical inspection applications for HBM, 2.5D/3D packaging, hybrid bonding, and next-generation package integration technologies.
  • •Lead customer evaluations, demos, beta-site activities, process qualifications, and proof-of-concept projects aligned to SOW, milestones, and deliverables.
  • •Interface with customer engineering and manufacturing teams to define inspection requirements, optimize recipes, and establish roadmap alignment.
  • •Develop and validate inspection methodologies using macro optical inspection, machine vision, AI defect classification, and integrated inspection solutions to maximize defect detection and system performance.
Travel: Medium travel

Key Requirements

  • •6+ years of experience in semiconductor manufacturing, inspection, metrology, yield engineering, or advanced packaging technologies.
  • •Strong knowledge of semiconductor advanced packaging processes including HBM, hybrid bonding, chiplet integration, wafer-level packaging, and advanced substrate technologies.
  • •Hands-on experience with optical inspection systems and machine vision applications, including defect inspection methodologies or process control solutions.
  • •Experience leading customer-facing technical projects, evaluations, and production qualifications including process qualifications and acceptance criteria.
  • •Strong project management, technical leadership, and problem-solving skills, with excellent English communication and presentation skills.
Experience:6+ yearsSemiconductor manufacturingInspectionMetrologyAdvanced packaging
Skills:Technical mentorshipPresentationsNegotiationCustomer engagementRoot cause analysisProblem-solvingCross-functional collaboration
Languages:English
Tech Stack:Kinex Mantis-DMantis-DMacro optical inspectionMachine visionAI-based defect classificationIntegrated inspection solutionsHypothesis experimentsDesign of experiments (DOEs)Chemical Vapor Deposition (CVD)Atomic Layer Deposition (ALD)Plasma Reactive Ion Etch (RIE)Physical Vapor Deposition (PVD)AnnealImplantHBM2.5D packaging3D packagingHybrid BondingChiplet integrationWafer-level packaging

Company Brief

Applied Materials
Provides semiconductor manufacturing equipment, services, and software used to build advanced chips and display technologies. Its tools support materials engineering, deposition, etching, inspection, and process control for major electronics manufacturers worldwide.
Industry: Industrial Machinery
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1967
Glassdoor
Glassdoor: 3.9
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