Packaging Quality Engineer

Cisco
Taipei
Workplace: HybridFull timeFunction: QA, Test & Release EngineeringExperience: 5+ yearsEducation: bachelorsSkills: ["Detail-oriented","Proactive","Continuous improvement mindset","Cross-functional collaboration","Communication","Presentation","Negotiation","Stakeholder management"]

Drive packaging quality for high-volume semiconductor manufacturing, partnering with Optics OSATs and the packaging supply chain to maintain operational consistency. Establish quality control protocols, manage process control plans for bumping, die attach, wirebonding, and flip-chip reliability, and deploy statistical process control (SPC) for real-time monitoring and corrections. Lead continuous improvement using quality methodologies to improve yield and reliability while analyzing metrics and mitigating supply chain risks.

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FursaFursa
Cisco
Cisco
4 hours ago

Packaging Quality Engineer

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Source: Company careers pageValidated by: Fursa AI
Last checked: 4 hours agoStatus: Live

Job Summary

Drive packaging quality for high-volume semiconductor manufacturing, partnering with Optics OSATs and the packaging supply chain to maintain operational consistency. Establish quality control protocols, manage process control plans for bumping, die attach, wirebonding, and flip-chip reliability, and deploy statistical process control (SPC) for real-time monitoring and corrections. Lead continuous improvement using quality methodologies to improve yield and reliability while analyzing metrics and mitigating supply chain risks.
Location: Taipei
Workplace: Hybrid
Employment Type: Full time
Job Function: QA, Test & Release Engineering
Seniority: Mid level

Key Responsibilities

  • •Drive stability in packaging manufacturing by establishing quality control protocols and identifying deviations on high-volume lines.
  • •Manage execution of packaging process control plans for bumping, die attach, wirebonding, and flip-chip reliability.
  • •Implement statistical process control (SPC) across OSAT production lines for real-time monitoring and proactive correction of process variables.
  • •Lead continuous improvement using statistical analysis and quality methodologies to resolve yield and reliability challenges.
  • •Aggregate and analyze quality metrics, mitigate supply chain risks, and partner on onsite audits and process assessments.

Key Requirements

  • •Bachelor’s degree in Engineering (Chemical, Materials, or related) from an accredited university.
  • •5+ years of experience in supplier quality engineering with semiconductor packaging process expertise.
  • •Strong quality systems and methodologies experience, including SPC, OCAP, FMEA, and APQP.
  • •Experience managing OSAT-side quality metrics, conducting onsite process audits, and mitigating supply chain risks.
  • •Ability to conduct root-cause troubleshooting and quality assurance across semiconductor packaging and assembly failures.
Experience:5+ yearsSupplier quality engineeringSemiconductor packagingSemiconductor substratesOSATQuality assurance
Education:Bachelor's in Engineering (Chemical, Materials, or related field)
Skills:Detail-orientedProactiveContinuous improvement mindsetCross-functional collaborationCommunicationPresentationNegotiationStakeholder management
Tech Stack:SPCOCAPFMEAAPQP

Company Brief

Cisco
Global technology company that designs, manufactures, and sells networking hardware, telecommunications equipment, and high-technology services and products for enterprises, service providers, and governments worldwide.
Industry: Networking Equipment
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: San Jose, United States
Founded: 1984
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