Staff/Senior Engineer -Package Health System and Analytics

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Data Analytics & Business IntelligenceExperience: 3+ yearsEducation: bachelorsSkills: ["Cross-functional collaboration","Problem-solving","Documentation","Sound judgment","Digital fluency"]

Develop and execute package health monitoring, simulation, and characterization, combining hands-on work in DFT with data analysis and reliability testing. Define health metrics, build detection and monitoring dashboards, and perform real-time defect classification (critical vs. non-critical). Run correlation/causation studies and predictive modeling, maintaining a knowledge base to support NPI handover and future technodes while establishing end-to-end traceability across wafer, assembly, and test stages.

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FursaFursa
Micron Technology
Micron Technology
1 week ago

Staff/Senior Engineer -Package Health System and Analytics

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Source: Company careers pageValidated by: Fursa AI
Last checked: 6 hours agoStatus: Live

Job Summary

Develop and execute package health monitoring, simulation, and characterization, combining hands-on work in DFT with data analysis and reliability testing. Define health metrics, build detection and monitoring dashboards, and perform real-time defect classification (critical vs. non-critical). Run correlation/causation studies and predictive modeling, maintaining a knowledge base to support NPI handover and future technodes while establishing end-to-end traceability across wafer, assembly, and test stages.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Data Analytics & Business Intelligence
Seniority: Mid level

Key Responsibilities

  • •Define quantitative package health metrics and build monitoring dashboards for continuous health assessment.
  • •Perform electrical and mechanical characterization of packages to support robust packaging solutions.
  • •Implement real-time defect detection and classification, and integrate advanced characterization results into predictive models.
  • •Conduct correlation and causation studies across process variables, defect patterns, and reliability outcomes while maintaining a structured knowledge base.
  • •Collaborate with process and equipment engineers to establish end-to-end traceability and develop data pipelines linking process, equipment signals, and defect signatures.

Pay and Benefits

Perks:Paid LeaveLearning BudgetWellness StipendEquityHealth Insurance

Key Requirements

  • •Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, or a related field.
  • •3+ years of experience in the semiconductor industry, preferably packaging, test, or reliability engineering.
  • •Strong data analytics and statistical modeling skills, with proficiency in Python/R for data analysis and visualization.
  • •Experience with AI/ML tools or statistical modeling, and the ability to use AI-enabled tools responsibly.
  • •Strong understanding of semiconductor packaging processes, material interactions, defect inspection systems, and inline metrology; ability to work cross-functionally.
Experience:3+ yearsSemiconductor industryPackagingTest engineeringReliability engineering
Education:Bachelor's in Electrical Engineering or Materials Science
Skills:Cross-functional collaborationProblem-solvingDocumentationSound judgmentDigital fluency
Tech Stack:DFTPythonRAI/MLPredictive modelsData pipelinesDashboards

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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Glassdoor: 3.7
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