Frontend Central Product Integration Engineering (cPIE) Transformative HVB (high-value-bits) Engineer

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityEducation: bachelorsSkills: ["Analytical thinking","Critical thinking","Communication","Collaboration","Continuous learning"]

Coordinate improvements in DRAM/NAND yield, quality, and output for the central process integration module by partnering with multi-functional network teams. Design, execute, and analyze process experiments, collect and interpret complex fab data, and troubleshoot wafer fabrication issues using root cause analysis. Communicate module issues to fab engineering leadership, collaborate across global partners, and standardize best-known methods to improve reliability and performance.

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FursaFursa
Micron Technology
Micron Technology
2 months ago

Frontend Central Product Integration Engineering (cPIE) Transformative HVB (high-value-bits) Engineer

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Source: Company careers pageValidated by: Fursa AI
Last checked: 18 hours agoStatus: Live

Job Summary

Coordinate improvements in DRAM/NAND yield, quality, and output for the central process integration module by partnering with multi-functional network teams. Design, execute, and analyze process experiments, collect and interpret complex fab data, and troubleshoot wafer fabrication issues using root cause analysis. Communicate module issues to fab engineering leadership, collaborate across global partners, and standardize best-known methods to improve reliability and performance.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community

Key Responsibilities

  • •Collaborate with multi-functional network teams to improve product yields and reliability within an assigned process loop.
  • •Design, execute, and analyze experiments to improve fab process, yield, and quality.
  • •Collect and interpret complex fab data to optimize processes and increase yields.
  • •Troubleshoot wafer fabrication problems and perform root cause analysis; communicate module issues to fab engineering and leadership.
  • •Engage with cross-area engineering teams and global partners to tackle process issues, align on topics, and drive business process alignment and standardization.
Travel: Medium travel

Key Requirements

  • •Bachelor’s or advanced degree in Materials Engineering, Electrical & Electronics Engineering, Chemical Engineering, Mechanical Engineering, Biomedical Engineering, or a related field.
  • •Strong analytical, logical, and critical thinking skills.
  • •Effective communication skills to collaborate across all levels.
  • •A growth mindset with passion for continuous learning.
  • •Internship or semiconductor industry experience is a plus; demonstrated leadership and impact are desirable.
Experience:Semiconductor industry
Education:Bachelor's
Skills:Analytical thinkingCritical thinkingCommunicationCollaborationContinuous learning
Tech Stack:DRAMNANDWafer fabricationProcess experimentsYield optimizationRoot cause analysis

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
Glassdoor
Glassdoor: 3.7
WebsiteLinkedIn