Director, Technical Package Development

Micron Technology
Boise, Idaho
Workplace: OnsiteFull timeFunction: Executive & General ManagementEducation: bachelorsSkills: ["Executive leadership","Strategic planning","Cross-functional collaboration","Customer engagement","Risk assessment"]

Lead the strategy, development, and execution of advanced DRAM packaging solutions for Micron’s next-generation products. Define technology roadmaps and drive innovation across packaging architectures such as HBM, LPDRAM, DDR, and 2.5D/3D heterogeneous integration and chiplets. Build and lead a global engineering organization, partner across design, manufacturing, quality, supply chain, and ecosystem partners, and improve execution through automation, knowledge management, and data-driven engineering processes.

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Micron Technology
Micron Technology
3 days ago

Director, Technical Package Development

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Job Summary

Lead the strategy, development, and execution of advanced DRAM packaging solutions for Micron’s next-generation products. Define technology roadmaps and drive innovation across packaging architectures such as HBM, LPDRAM, DDR, and 2.5D/3D heterogeneous integration and chiplets. Build and lead a global engineering organization, partner across design, manufacturing, quality, supply chain, and ecosystem partners, and improve execution through automation, knowledge management, and data-driven engineering processes.
Location: Boise, Idaho
Workplace: Onsite
Employment Type: Full time
Job Function: Executive & General Management
Seniority: Director level

Key Responsibilities

  • •Define and execute long-term DRAM packaging strategies aligned to future product, technology, and business objectives.
  • •Lead development and deployment of advanced packaging technologies including HBM, LPDRAM, DDR, 2.5D/3D integration, heterogeneous integration, chiplets, and next-generation interconnect solutions.
  • •Drive adoption of AI, machine learning, advanced analytics, and digital engineering to improve product development and engineering productivity.
  • •Build, develop, and lead a global packaging organization focused on innovation, technical excellence, accountability, and operational execution.
  • •Partner across design, product engineering, manufacturing, quality, supply chain, and technology development to deliver successful products from concept through high-volume manufacturing.

Pay and Benefits

Perks:Medical PlansDental PlansVision PlansPaid LeavePaid Holidays

Key Requirements

  • •Bachelor’s degree in Engineering, Materials Science, Physics, Computer Engineering, or a related technical field.
  • •15+ years of semiconductor packaging experience delivering advanced packaging technologies from development through high-volume manufacturing.
  • •10+ years of experience leading engineering teams, complex technology programs, or global engineering organizations.
  • •Expertise in advanced packaging technologies including HBM, LPDRAM, DDR, 3D stacking, heterogeneous integration, or related platforms.
  • •Proven experience making business-critical technology decisions using technical analysis, risk assessment, and multi-functional collaboration.
Experience:Semiconductor packagingDRAMHigh-volume manufacturingAI/MLDigital engineering
Education:Bachelor's
Skills:Executive leadershipStrategic planningCross-functional collaborationCustomer engagementRisk assessment
Tech Stack:HBMLPDRAMDDR2.5D integration3D integrationHeterogeneous integrationChipletsAdvanced analyticsDigital engineeringAutomationKnowledge managementData-driven decision makingAIMachine learning

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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