Technology Development Engineer – Hybrid Bonding & Advanced Packaging (Internship)

Applied Materials
Singapore
Workplace: OnsiteInternshipFunction: Product ManagementSkills: ["Data analysis","Engineering problem-solving","Experimental design"]

Support the Process Integration team on R&D for next-generation semiconductor advanced packaging, focusing on hybrid bonding technologies. Help develop and characterize test vehicles for chip-to-wafer and wafer-to-wafer hybrid bonding, including redistribution layers (RDL), damascene copper structures, and wafer-level interconnects. Contribute to process flow development, experimental design, data analysis, defect characterization, and correlation of process parameters to electrical and physical performance metrics.

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Applied Materials
Applied Materials
13 hours ago

Technology Development Engineer – Hybrid Bonding & Advanced Packaging (Internship)

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Last checked: 8 hours agoStatus: Live

Job Summary

Support the Process Integration team on R&D for next-generation semiconductor advanced packaging, focusing on hybrid bonding technologies. Help develop and characterize test vehicles for chip-to-wafer and wafer-to-wafer hybrid bonding, including redistribution layers (RDL), damascene copper structures, and wafer-level interconnects. Contribute to process flow development, experimental design, data analysis, defect characterization, and correlation of process parameters to electrical and physical performance metrics.
Location: Singapore
Workplace: Onsite
Employment Type: Internship
Job Function: Product Management
Seniority: Intern level

Key Responsibilities

  • •Support development and characterization of test vehicles for chip-to-wafer and wafer-to-wafer hybrid bonding applications.
  • •Develop process flows and assist with process integration activities for advanced packaging building blocks.
  • •Design and execute experiments to generate data for electrical and physical performance evaluation.
  • •Perform data analysis and defect characterization, then correlate process parameters to outcomes.
  • •Contribute to ongoing R&D projects to build understanding of advanced packaging and engineering best practices.

Key Requirements

  • •Support process flow development and experimental design for advanced packaging hybrid bonding test vehicles.
  • •Perform data analysis to evaluate electrical and physical performance metrics.
  • •Conduct defect characterization and analyze outcomes from experiments.
  • •Correlate process parameters with electrical and physical performance results.
  • •Apply engineering problem-solving methodologies and process integration principles to ongoing R&D projects.
Skills:Data analysisEngineering problem-solvingExperimental design

Company Brief

Applied Materials
Provides semiconductor manufacturing equipment, services, and software used to build advanced chips and display technologies. Its tools support materials engineering, deposition, etching, inspection, and process control for major electronics manufacturers worldwide.
Industry: Industrial Machinery
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1967
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