Principal Engineer, Adv DRAM PI

Micron Technology
Boise
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityExperience: 5+ yearsEducation: mastersSkills: ["Project management","Cross-functional leadership","Technical communication","Experimental analysis","Problem-solving"]

Lead advanced development for next-generation 3D DRAM in Micron’s Technology Development organization. You’ll partner across build, probe, and yield improvement teams to tackle scaling, performance, and power challenges—optimizing process flows, designing and executing R&D fab experiments, and diagnosing failure mechanisms using methods like 8D, FMEA, and SPC. Communicate findings clearly and drive actionable improvements in product quality, reliability, and manufacturability.

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FursaFursa
Micron Technology
Micron Technology
2 months ago

Principal Engineer, Adv DRAM PI

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Job Summary

Lead advanced development for next-generation 3D DRAM in Micron’s Technology Development organization. You’ll partner across build, probe, and yield improvement teams to tackle scaling, performance, and power challenges—optimizing process flows, designing and executing R&D fab experiments, and diagnosing failure mechanisms using methods like 8D, FMEA, and SPC. Communicate findings clearly and drive actionable improvements in product quality, reliability, and manufacturability.
Location: Boise
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Manager level

Key Responsibilities

  • •Lead technology development and a group of engineers focused on enabling vertically stacked DRAM, including charge storage devices and thin-film transistors.
  • •Optimize process flows to improve product quality, reliability, and manufacturability.
  • •Collaborate with multi-functional teams (build, probe, yield improvement) to resolve complex performance issues.
  • •Design and execute experiments in the R&D fab to evaluate and optimize process, equipment, and material changes.
  • •Analyze inline, parametric, and probe data to diagnose failure mechanisms using 8D, FMEA, or SPC and drive implementation of solutions.

Pay and Benefits

Perks:Health InsuranceDentalVisionPaid LeavePaid HolidaysParental Leave

Key Requirements

  • •MS or PhD in Physics, Materials Science, Electrical Engineering, or a related technical field.
  • •5+ years of relevant industry experience in semiconductor process integration or development.
  • •Strong functional knowledge of semiconductor device physics and materials science.
  • •Proven project management skills, including experience leading cross-functional technical teams.
  • •Experience with next-generation memory technology development and experimentation.
Experience:5+ yearsSemiconductorsMemory technologiesDRAM3D DRAMR&D
Education:Master's
Skills:Project managementCross-functional leadershipTechnical communicationExperimental analysisProblem-solving
Tech Stack:3D DRAMDRAMNANDSemiconductor device physicsMaterials scienceThin-film transistors8DFMEASPC

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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