Director, Package Quality and Reliability

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Quality & Regulatory (Non-Software)Experience: 12+ yearsSkills: ["Leadership","Cross-functional collaboration","Structured problem-solving","Decision-making","Clear communication"]

Lead package reliability, qualification, and failure analysis for new product introductions and high-volume manufacturing. Own risk identification and mitigation across chip-to-package interaction, interconnect reliability, thermo-mechanical stress, and materials failure modes. Drive qualification rigor, test plan readiness, and failure analysis using structured methods like 8D. Partner with package development, front-end fab, manufacturing, and quality teams while building engineering capability, setting KPIs, and managing budgets to support successful product ramps across mobile, automotive, data center, and AI/HPC.

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FursaFursa
Micron Technology
Micron Technology
1 month ago

Director, Package Quality and Reliability

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Last checked: 19 hours agoStatus: Live

Job Summary

Lead package reliability, qualification, and failure analysis for new product introductions and high-volume manufacturing. Own risk identification and mitigation across chip-to-package interaction, interconnect reliability, thermo-mechanical stress, and materials failure modes. Drive qualification rigor, test plan readiness, and failure analysis using structured methods like 8D. Partner with package development, front-end fab, manufacturing, and quality teams while building engineering capability, setting KPIs, and managing budgets to support successful product ramps across mobile, automotive, data center, and AI/HPC.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Quality & Regulatory (Non-Software)
Seniority: Director level

Key Responsibilities

  • •Lead execution of package reliability qualification for new product introductions and ongoing reliability monitoring in high-volume manufacturing.
  • •Identify and resolve key reliability risks across chip-to-package interaction, interconnect reliability, thermo-mechanical stress, and material-related failure mechanisms.
  • •Improve reliability test coverage and methodologies aligned to end-use application requirements (e.g., automotive, mobile, data center).
  • •Drive robust qualification processes, test plans, and reliability sign-off readiness.
  • •Lead failure analysis and root cause investigations using structured methodologies (e.g., 8D) and provide technical risk assessment/disposition recommendations.

Key Requirements

  • •Bachelor’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, or a related field (Master’s or Ph.D. preferred).
  • •12+ years of experience in semiconductor packaging, reliability, or manufacturing.
  • •5+ years of experience in people management or technical leadership roles.
  • •Experience with package reliability test methodologies (e.g., temperature cycling, HAST, MSL/preconditioning, board-level reliability) and standards (JEDEC, AEC-Q).
  • •Hands-on failure analysis and root cause analysis techniques (e.g., cross-sectioning, SAM, X-ray, SEM/EDX) with knowledge of chip-to-package interaction and thermo-mechanical stress.
Experience:12+ yearsSemiconductor packagingManufacturingHigh-volume manufacturingReliability engineeringFailure analysis
Education:
Skills:LeadershipCross-functional collaborationStructured problem-solvingDecision-makingClear communication

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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