College Intern - GT Indigo Inter-Die Gapfill Process and Integration for 3DIC

Applied Materials
Singapore
Workplace: OnsiteInternshipFunction: Communications, PR & CommunityExperience: 2-8 yearsSkills: ["Problem-solving","Analytical skills","Communication","Collaboration"]

Support the development, characterization, and optimization of thin-film deposition processes for advanced semiconductor packaging. Assist with designing and executing process experiments, running wafer processing per procedures, and analyzing results. Collect and characterize metrology data (thickness uniformity, refractive index, stress, composition, surface roughness, and electrical properties) and apply statistical methods and data visualization. Help troubleshoot process/equipment issues, document findings, and present progress to engineering leadership while collaborating across process, hardware, manufacturing, and product teams.

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Applied Materials
Applied Materials
1 week ago

College Intern - GT Indigo Inter-Die Gapfill Process and Integration for 3DIC

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Job Summary

Support the development, characterization, and optimization of thin-film deposition processes for advanced semiconductor packaging. Assist with designing and executing process experiments, running wafer processing per procedures, and analyzing results. Collect and characterize metrology data (thickness uniformity, refractive index, stress, composition, surface roughness, and electrical properties) and apply statistical methods and data visualization. Help troubleshoot process/equipment issues, document findings, and present progress to engineering leadership while collaborating across process, hardware, manufacturing, and product teams.
Location: Singapore
Workplace: Onsite
Employment Type: Internship
Job Function: Communications, PR & Community
Seniority: Intern level

Key Responsibilities

  • •Assist engineers in designing and executing process engineering experiments and support optimization of CVD/PECVD/PEALD or related thin film deposition processes.
  • •Perform wafer processing and experimental runs according to defined procedures, analyze process results, and identify opportunities for performance improvement.
  • •Collect, analyze, and characterize process and metrology data (e.g., thickness uniformity, refractive index, stress, composition, surface roughness, and electrical properties).
  • •Support troubleshooting of process and equipment-related issues, participate in root cause analysis, and document findings with proposed corrective actions.
  • •Maintain accurate experimental records and engineering logs, prepare technical reports/presentations, and present internship results to engineering leadership while collaborating cross-functionally.

Key Requirements

  • •Knowledge of semiconductor manufacturing processes.
  • •Basic understanding of thin film deposition, plasma processing, or surface science.
  • •Experience with experimental design and data analysis.
  • •Strong problem-solving and analytical skills.
  • •Effective verbal and written communication skills with ability to work independently and collaboratively.
Experience:2-8 yearsSemiconductor manufacturingSemiconductor equipmentAdvanced packagingThin films3DIC
Skills:Problem-solvingAnalytical skillsCommunicationCollaboration
Tech Stack:CVDPECVDPEALDPlasma processingThin film depositionMetrologyStatistical methodsData visualizationAI-assisted process optimizationAutoCADANSYS

Company Brief

Applied Materials
Provides semiconductor manufacturing equipment, services, and software used to build advanced chips and display technologies. Its tools support materials engineering, deposition, etching, inspection, and process control for major electronics manufacturers worldwide.
Industry: Industrial Machinery
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1967
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