Advanced Packaging Process Support Engineer

Applied Materials
South Korea
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityExperience: 3-10 yearsEducation: bachelorsSkills: ["Responsibility","Diligence","Communication","Interpersonal skills","Root cause analysis"]

Provide hands-on, customer-facing technical support for advanced semiconductor packaging using Applied’s KINEX hybrid bonding systems. Support installation, qualification, troubleshooting, and process stabilization, while optimizing die-to-wafer bonding processes. Act as a process owner for hybrid bonding technologies in partnership with customer engineering teams, design and execute DOE experiments, analyze data, and resolve complex equipment/process issues through structured root-cause analysis and collaboration across teams.

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FursaFursa
Applied Materials
Applied Materials
3 months ago

Advanced Packaging Process Support Engineer

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Last checked: 2 hours agoStatus: Live

Job Summary

Provide hands-on, customer-facing technical support for advanced semiconductor packaging using Applied’s KINEX hybrid bonding systems. Support installation, qualification, troubleshooting, and process stabilization, while optimizing die-to-wafer bonding processes. Act as a process owner for hybrid bonding technologies in partnership with customer engineering teams, design and execute DOE experiments, analyze data, and resolve complex equipment/process issues through structured root-cause analysis and collaboration across teams.
Location: South Korea
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Provide on-site technical support for Applied KINEX bonding systems, including installation, qualification, troubleshooting, and process stabilization.
  • •Support and optimize die-to-wafer bonding processes for advanced packaging applications.
  • •Act as a process owner for Hybrid Bonding technologies, working closely with customer engineering teams.
  • •Design and execute process experiments and DOE, analyze data, and deliver clear technical conclusions.
  • •Resolve complex equipment and process issues using structured root cause analysis and collaborate to ensure stable production and yield improvement.

Pay and Benefits

Perks:Employee AssistanceTravel Allowance

Key Requirements

  • •Bachelor’s degree in Materials Science, Chemistry, Electrical/Electronics Engineering, Semiconductor Engineering, or a related field.
  • •3–10 years of experience in semiconductor process engineering, equipment support, or advanced packaging.
  • •Ability to perform in physically demanding fab environments with strong responsibility and diligence.
  • •Strong communication and interpersonal skills for customer and global collaboration.
  • •English proficiency for technical documentation and global collaboration.
Experience:3-10 yearsSemiconductor process engineeringAdvanced packagingEquipment support
Education:Bachelor's
Skills:ResponsibilityDiligenceCommunicationInterpersonal skillsRoot cause analysis
Languages:English
Tech Stack:Chemical Vapor DepositionAtomic Layer DepositionPlasma Reactive Ion EtchPhysical Vapor DepositionAnnealImplantDesign of experiments (DOE)Hybrid BondingDie-to-wafer bondingWafer-to-wafer bondingFusion bondingDRY&WET cleaningTC& Flip chip bondingKINEX systems

Company Brief

Applied Materials
Provides semiconductor manufacturing equipment, services, and software used to build advanced chips and display technologies. Its tools support materials engineering, deposition, etching, inspection, and process control for major electronics manufacturers worldwide.
Industry: Industrial Machinery
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1967
Glassdoor
Glassdoor: 3.9
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