Package Assembly Process Development Integration Engineer

Intel
Phoenix
Workplace: OnsiteFull timeUSD 89,010 - 170,630 annuallyFunction: Manufacturing & Production OperationsExperience: 3+ yearsEducation: bachelorsSkills: ["Collaboration","Innovative thinking","Attention to detail","Proactive problem-solving","Communication"]

Drive process integration and yield improvements for Intel’s advanced packaging programs. Own development activities and working groups in the Arizona Package Assembly Development Integration team within APTM, defining integration roadmaps, establishing workflows, and managing data collection. Lead DOE planning, characterize die-package interactions using advanced techniques, validate process specifications and design rules, and collaborate cross-organizationally to deliver cost-effective, high-quality manufacturing outcomes.

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FursaFursa
Intel
Intel
4 days ago

Package Assembly Process Development Integration Engineer

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Source: Company careers pageValidated by: Fursa AI
Last checked: 11 hours agoStatus: Live

Job Summary

Drive process integration and yield improvements for Intel’s advanced packaging programs. Own development activities and working groups in the Arizona Package Assembly Development Integration team within APTM, defining integration roadmaps, establishing workflows, and managing data collection. Lead DOE planning, characterize die-package interactions using advanced techniques, validate process specifications and design rules, and collaborate cross-organizationally to deliver cost-effective, high-quality manufacturing outcomes.
Location: Phoenix
Workplace: Onsite
Employment Type: Full time
Job Function: Manufacturing & Production Operations
Seniority: Mid level

Key Responsibilities

  • •Manage development and baseline data collection activities for TV and products.
  • •Serve as the key contact for process-level issues within package assembly.
  • •Manage DOE plans and data collection for die-package interactions, process flow development and qualification, yield improvement, and validation activities.
  • •Identify and implement cost-effective wafer level/assembly/substrate solutions to support a robust die-package process and architecture.
  • •Work with stakeholders to deliver holistic solutions, develop data-driven problem-solving approaches, and manage substrates and materials to meet cost and schedule.
Travel: Low travel

Pay and Benefits

Salary: USD 89,010 - 170,630 annually
Equity and Bonus:Equity
Perks:Health InsuranceRetirementPaid Leave

Key Requirements

  • •Bachelor’s degree with 3+ years of experience, or Master’s degree with 2+ years, or PhD in Engineering with 1+ year.
  • •Experience in semiconductor, manufacturing, or advanced assembly packaging.
  • •3+ years focused on fundamental understanding of advanced packaging process development.
  • •Knowledge of Package Assembly NPI methodology, DOE, and statistical process control.
  • •Knowledge of characterization techniques such as CSAM, Xray, XPS, FTIR, SEM, or EDX.
Experience:3+ yearsSemiconductorManufacturingAdvanced packaging
Education:Bachelor's in Engineering
Skills:CollaborationInnovative thinkingAttention to detailProactive problem-solvingCommunication
Tech Stack:DOEStatistical process controlCSAMXrayXPSFTIRSEMEDXDesign rule validationProcess spec validation

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
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Glassdoor: 3.8
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