Intel

1 week ago

Assembly Media and Collaterals Development Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 1 minute agoStatus: Live

Job Summary

Develop media and collateral solutions for assembly processes and equipment to advance next-generation assembly packaging technologies. Optimize manufacturing efficiency while meeting quality, reliability, cost, yield, productivity, and manufacturability requirements. Create media and collateral specifications using design of experiments and data analysis, build test equipment for simulated field conditions, and develop new techniques and quality screens to catch issues early. Lead innovation and standardization through documentation and cross-team collaboration.

Location: Malaysia

Workplace: Onsite

Employment Type: Full time

Job Function: Manufacturing & Production Operations

Seniority: Mid level

Key Responsibilities

•Develop media and collaterals for assembly processes and/or equipment to support Intel’s assembly packaging technology roadmap.
•Optimize manufacturing efficiency and develop improvements to meet quality, reliability, cost, yield, productivity, and manufacturability requirements.
•Develop media and collateral specifications using DOE principles and document improvements through white papers.
•Develop and maintain equipment to evaluate media and collateral solutions under simulated field use conditions (e.g., heat, humidity, vibration, temperature cycles).
•Lead innovation and continuous improvement of media and collaterals using experimental design and statistical methods while supporting standardization and qualification milestones.

Key Requirements

•Bachelor’s or Master’s degree in Mechanical Engineering, Material Engineering, Electrical Engineering, or Physics-related field.
•Minimum 2+ years’ experience applying fundamental science and engineering concepts to develop novel solutions, including knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE).
•Experience using analytics and design tools in the packaging industry (e.g., AutoCAD, SolidWorks).
•Experience with engineering drawings and tolerancing analysis, design rules.
•Preferred: strong mechanical design software experience (SolidWorks, AutoCAD) and semiconductor fabrication/process understanding with analytical skills.

Experience:2+ yearsSemiconductor manufacturingPackagingManufacturing

Education:Master's in Mechanical Engineering/Material Engineering/Electrical Engineering/Physics related field

Skills:InnovationProblem-solvingConsultationCross-functional collaborationTechnical documentation

Tech Stack:Statistical Process Control (SPC)Design of Experiments (DOE)AutoCADSolidWorksEngineering drawingTolerancing analysisData analysis

Company Brief

Intel

Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1968

Glassdoor: 3.8

Website LinkedIn Glassdoor

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Intel

1 week ago

Assembly Media and Collaterals Development Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 1 minute agoStatus: Live

Job Summary

Location: Malaysia

Workplace: Onsite

Employment Type: Full time

Job Function: Manufacturing & Production Operations

Seniority: Mid level

Key Responsibilities

•Develop media and collaterals for assembly processes and/or equipment to support Intel’s assembly packaging technology roadmap.
•Optimize manufacturing efficiency and develop improvements to meet quality, reliability, cost, yield, productivity, and manufacturability requirements.
•Develop media and collateral specifications using DOE principles and document improvements through white papers.
•Develop and maintain equipment to evaluate media and collateral solutions under simulated field use conditions (e.g., heat, humidity, vibration, temperature cycles).
•Lead innovation and continuous improvement of media and collaterals using experimental design and statistical methods while supporting standardization and qualification milestones.

Key Requirements

•Bachelor’s or Master’s degree in Mechanical Engineering, Material Engineering, Electrical Engineering, or Physics-related field.
•Minimum 2+ years’ experience applying fundamental science and engineering concepts to develop novel solutions, including knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE).
•Experience using analytics and design tools in the packaging industry (e.g., AutoCAD, SolidWorks).
•Experience with engineering drawings and tolerancing analysis, design rules.
•Preferred: strong mechanical design software experience (SolidWorks, AutoCAD) and semiconductor fabrication/process understanding with analytical skills.

Experience:2+ yearsSemiconductor manufacturingPackagingManufacturing

Education:Master's in Mechanical Engineering/Material Engineering/Electrical Engineering/Physics related field

Skills:InnovationProblem-solvingConsultationCross-functional collaborationTechnical documentation

Tech Stack:Statistical Process Control (SPC)Design of Experiments (DOE)AutoCADSolidWorksEngineering drawingTolerancing analysisData analysis

Company Brief

Intel

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1968

Glassdoor: 3.8

Website LinkedIn Glassdoor