Physical Design Engineer

Broadcom
San Jose
Workplace: OnsiteFull timeUSD 143,800 - 230,000 annuallyFunction: Design (Product/UX/UI/Visual)Experience: 12+ yearsEducation: bachelorsSkills: ["Self-starter","Ability to manage multiple concurrent customers","Comfort providing guidance with incomplete information","Collaboration","Direction setting"]

Develop physical layout and power/interconnect design for next-generation ASIC products, with a focus on parallel interfaces and advanced 2.5D/3D die-die interconnects. Own DRC/LVS and electrical checking, evaluate ubump/RDL patterning, and collaborate with SI/PI engineers. Automate layout workflows using TCL and Python, contribute to new interconnect technology and IP development, and support advanced packaging technology/testchip roadmapping.

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FursaFursa
Broadcom
Broadcom
3 days ago

Physical Design Engineer

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Source: Company careers pageValidated by: Fursa AI
Last checked: 21 hours agoStatus: Live

Job Summary

Develop physical layout and power/interconnect design for next-generation ASIC products, with a focus on parallel interfaces and advanced 2.5D/3D die-die interconnects. Own DRC/LVS and electrical checking, evaluate ubump/RDL patterning, and collaborate with SI/PI engineers. Automate layout workflows using TCL and Python, contribute to new interconnect technology and IP development, and support advanced packaging technology/testchip roadmapping.
Location: San Jose
Workplace: Onsite
Employment Type: Full time
Job Function: Design (Product/UX/UI/Visual)

Key Responsibilities

  • •Implement physical layout for power grids and 2.5D/3D die-die interconnects.
  • •Run DRC, LVS, and electrical checking to validate designs.
  • •Automate common processes and design steps to improve layout efficiency.
  • •Develop high-speed signal interconnects in collaboration with SI and PI engineers.
  • •Evaluate and develop new 2.5D/3D interconnect technologies and support technology/testchip roadmapping for advanced packaging.

Pay and Benefits

Salary: USD 143,800 - 230,000 annually
Equity and Bonus:Equity
Perks:Health InsuranceDentalVision401kEquityEsppEapPaid HolidaysPaid Leave

Key Requirements

  • •Bachelor's degree in Electrical Engineering or Computer Science with 12+ years of related work experience, or a Master's degree with 10+ years.
  • •Strong physical layout experience for ICs/packages/PCBs using layout databases and tools.
  • •Ability to perform DRC, LVS, and electrical checking for interconnect and power grid designs.
  • •Strong TCL and Python scripting experience to automate routine design processes.
  • •Experience developing and evaluating 2.5D and 3D interconnect technologies (including ubump and RDL pattern electrical analysis/optimization).
Experience:12+ yearsASICSemiconductors2.5D interconnects3D interconnectsAdvanced packaging
Education:Bachelor's in Electrical Engineering or Computer Science
Skills:Self-starterAbility to manage multiple concurrent customersComfort providing guidance with incomplete informationCollaborationDirection setting
Tech Stack:TCLPython

Company Brief

Broadcom
Designs, develops, and supplies a broad range of semiconductor and infrastructure software solutions for the data center, networking, broadband, wireless, storage, and industrial markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Irvine, United States
Founded: 1991
WebsiteLinkedIn