Intel

1 day ago

Advanced Packaging Metro Module Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 8 hours agoStatus: Live

Job Summary

Own and optimize high-volume manufacturing equipment and processes for Intel’s next-generation advanced packaging technologies, including FOVEROS-S and EMIB. Conduct tests and measurements to control critical dimensions and reduce defects, implement equipment modifications, and manage maintenance and upgrades. Lead continuous improvement across safety, quality, yield, and cost, support equipment installation and qualification during factory ramps, and enable technology transfer to global manufacturing sites.

Location: Albuquerque

Workplace: Onsite

Employment Type: Full time

Job Function: Manufacturing & Production Operations

Seniority: Mid level

Key Responsibilities

•Oversee high-volume manufacturing equipment and processes to support production of advanced integrated circuits.
•Conduct tests and measurements to maintain control of critical dimensions and minimize defectivity.
•Implement equipment modifications to improve production efficiency and meet safety, quality, and cost objectives.
•Manage maintenance, repairs, and upgrades for equipment and associated module components.
•Drive continuous improvement on safety, quality, cost efficiency, yield, and defect reduction, including technology transfer through training and audits.

Pay and Benefits

Salary: USD 120,860 - 170,630 annually

Equity and Bonus:Equity

Perks:Health InsuranceRetirementPaid LeaveEquity

Key Requirements

•Bachelor’s or BS degree in a STEM-related field (or equivalent education).
•Minimum 4 years of experience with a Bachelor’s degree (or 3 years with a Master’s degree, or a PhD).
•Experience with equipment monitoring, process characterization, manufacturing process improvement, and semiconductor equipment.
•Experience in manufacturing process change and optical characterization.
•Preferred: understanding of metrology fundamentals, including tool matching/calibration and development.

Experience:4+ yearsSemiconductorsAdvanced packagingManufacturingEquipment monitoringProcess characterization

Education:Bachelor's in STEM-related field

Skills:Continuous improvementCollaborationProject leadershipProblem solving

Tech Stack:FOVEROS-SEMIBMetrologyTool matchingCalibrationProcess characterizationOptical characterizationEquipment automationSemiconductor process flowsAdvanced packaging

Company Brief

Intel

Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1968

Glassdoor: 3.8

Website LinkedIn Glassdoor

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Intel

1 day ago

Advanced Packaging Metro Module Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 8 hours agoStatus: Live

Job Summary

Location: Albuquerque

Workplace: Onsite

Employment Type: Full time

Job Function: Manufacturing & Production Operations

Seniority: Mid level

Key Responsibilities

•Oversee high-volume manufacturing equipment and processes to support production of advanced integrated circuits.
•Conduct tests and measurements to maintain control of critical dimensions and minimize defectivity.
•Implement equipment modifications to improve production efficiency and meet safety, quality, and cost objectives.
•Manage maintenance, repairs, and upgrades for equipment and associated module components.
•Drive continuous improvement on safety, quality, cost efficiency, yield, and defect reduction, including technology transfer through training and audits.

Pay and Benefits

Salary: USD 120,860 - 170,630 annually

Equity and Bonus:Equity

Perks:Health InsuranceRetirementPaid LeaveEquity

Key Requirements

•Bachelor’s or BS degree in a STEM-related field (or equivalent education).
•Minimum 4 years of experience with a Bachelor’s degree (or 3 years with a Master’s degree, or a PhD).
•Experience with equipment monitoring, process characterization, manufacturing process improvement, and semiconductor equipment.
•Experience in manufacturing process change and optical characterization.
•Preferred: understanding of metrology fundamentals, including tool matching/calibration and development.

Experience:4+ yearsSemiconductorsAdvanced packagingManufacturingEquipment monitoringProcess characterization

Education:Bachelor's in STEM-related field

Skills:Continuous improvementCollaborationProject leadershipProblem solving

Tech Stack:FOVEROS-SEMIBMetrologyTool matchingCalibrationProcess characterizationOptical characterizationEquipment automationSemiconductor process flowsAdvanced packaging

Company Brief

Intel

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1968

Glassdoor: 3.8

Website LinkedIn Glassdoor