Advanced Packaging Development Engineer

Broadcom
Irvine
Workplace: OnsiteFull timeUSD 127,100 - 203,400 annuallyFunction: Product ManagementExperience: 10+ yearsSkills: ["Project management","Teamwork","Communication","Problem-solving"]

Lead development of advanced packaging technologies (2.5D/3D, HBM) to integrate memory dies and SoC dies for AI-related products. Drive 3–5 year packaging roadmaps, roadmap components, reliability and yield improvements, and cross-functional collaboration to enable next-gen packaging solutions.

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FursaFursa
Broadcom
Broadcom
3 months ago

Advanced Packaging Development Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 15 days agoStatus: Live

Job Summary

Lead development of advanced packaging technologies (2.5D/3D, HBM) to integrate memory dies and SoC dies for AI-related products. Drive 3–5 year packaging roadmaps, roadmap components, reliability and yield improvements, and cross-functional collaboration to enable next-gen packaging solutions.
Location: Irvine
Workplace: Onsite
Employment Type: Full time
Job Function: Product Management

Key Responsibilities

  • •Develop and maintain the packaging technology roadmap for 3-5 years.
  • •Support development of key components (HBM, iVR, Si Cap) for advanced packaging.
  • •Manage reliability testing to qualify new technology.
  • •Lead yield improvement activities during new technology ramp-up.
  • •Collaborate across cross-functional teams to drive technology innovation and enablement.

Pay and Benefits

Salary: USD 127,100 - 203,400 annually
Equity and Bonus:Equity
Perks:MedicalDentalVision401kEsppEapPaid HolidaysPaid Leave

Key Requirements

  • •MS in a related engineering field with at least 10 years of direct experience (or 7 years with a PhD)
  • •Experience with 2.5D/3D packaging and HBM technology development
  • •Experience in reliability and yield improvements for new packaging technologies
  • •Strong project management and teamwork skills
  • •Technology innovation, development, and enablement capabilities
Experience:10+ yearsSemiconductorPackagingHBM2.5D3D
Skills:Project managementTeamworkCommunicationProblem-solving
Tech Stack:HBM2.5D3D packagingSiCapReliability testing

Company Brief

Broadcom
Designs, develops, and supplies a broad range of semiconductor and infrastructure software solutions for the data center, networking, broadband, wireless, storage, and industrial markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Irvine, United States
Founded: 1991
WebsiteLinkedIn