Advanced Packaging Development Engineer
Broadcom
Irvine
Workplace: OnsiteFull timeUSD 127,100 - 203,400 annuallyFunction: Product ManagementExperience: 10+ yearsSkills: ["Project management","Teamwork","Communication","Problem-solving"]Lead development of advanced packaging technologies (2.5D/3D, HBM) to integrate memory dies and SoC dies for AI-related products. Drive 3–5 year packaging roadmaps, roadmap components, reliability and yield improvements, and cross-functional collaboration to enable next-gen packaging solutions.

