CUF TD Module Engineer

Intel
Malaysia
Workplace: OnsiteFull timeFunction: Industrial, Process & Manufacturing EngineeringExperience: 3+ yearsEducation: mastersSkills: []

Develop assembly processes and equipment for Intel’s CUF (capillary underfill) module, applying novel concepts to support future assembly packaging platform technologies. Optimize manufacturing efficiency for quality, reliability, cost, yield, productivity, and manufacturability. Create process and equipment specifications using design of experiments and statistical methods, evaluate technologies under simulated field conditions, and partner with suppliers and engineering groups to standardize qualification and improve risk areas for product milestones.

Loading

Loading job details...

Preparing the role view and application actions.

FursaFursa
Intel
Intel
3 days ago

CUF TD Module Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 14 hours agoStatus: Live

Job Summary

Develop assembly processes and equipment for Intel’s CUF (capillary underfill) module, applying novel concepts to support future assembly packaging platform technologies. Optimize manufacturing efficiency for quality, reliability, cost, yield, productivity, and manufacturability. Create process and equipment specifications using design of experiments and statistical methods, evaluate technologies under simulated field conditions, and partner with suppliers and engineering groups to standardize qualification and improve risk areas for product milestones.
Location: Malaysia
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering
Seniority: Mid level

Key Responsibilities

  • •Develop assembly processes and/or equipment for the CUF (capillary underfill) module to enable Intel’s future assembly packaging platform roadmap.
  • •Optimize manufacturing efficiency for quality, reliability, cost, yield, productivity, and manufacturability requirements.
  • •Develop process and equipment specifications using design of experiments and data analysis, documenting improvements via white papers.
  • •Develop and maintain equipment to evaluate silicon and package technologies under simulated field-use conditions (e.g., heat, humidity, temperature cycling, dynamic forces).
  • •Establish material specifications for contract assemblers and raw material vendors and coordinate with supplier quality and procurement to meet material quality and vendor performance requirements.

Key Requirements

  • •MSc/PhD in Mechanical, Material, Electrical, Chemical Engineering, or Physics with a focus on thermal/fluid/packaging assembly process engineering, plus at least 3 years of working experience (Bachelor’s with strong relevant experience may be considered).
  • •Fundamental understanding of semiconductor assembly equipment and processes.
  • •Developing new processes through hardware/toolset development is a plus.
Experience:3+ years
Education:Master's in Mechanical Engineering/Material Engineering/Electrical Engineering/Chemical Engineering/Physics (focus on thermal/fluid/packaging assembly process engineering)
Tech Stack:CUF (capillary underfill)Design of experimentsData analysisStatistical methodsWhite papersHardware/toolset development

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
Glassdoor
Glassdoor: 3.8
WebsiteLinkedInGlassdoor