Wet Process, CMP and Bond MDE Principal Lead Engineer

Micron Technology
Boise
Workplace: OnsiteFull timeFunction: Administration & Executive AssistanceEducation: bachelorsSkills: ["Leadership","Problem-solving","Interpersonal skills","Collaboration","Mentoring"]

Lead wet process, CMP, and bonding development execution for next-generation DRAM technology. You’ll drive multi-functional process development priorities, oversee wafer movement and data quality, and manage 24/7 shift operations for performance, benchmarks, and line-down recovery. Combine people leadership with technical direction to mentor engineers, improve workflows and development systems, and expand AI adoption to accelerate reliable, fast development cycles.

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Micron Technology
Micron Technology
3 weeks ago

Wet Process, CMP and Bond MDE Principal Lead Engineer

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Last checked: 2 hours agoStatus: Live

Job Summary

Lead wet process, CMP, and bonding development execution for next-generation DRAM technology. You’ll drive multi-functional process development priorities, oversee wafer movement and data quality, and manage 24/7 shift operations for performance, benchmarks, and line-down recovery. Combine people leadership with technical direction to mentor engineers, improve workflows and development systems, and expand AI adoption to accelerate reliable, fast development cycles.
Location: Boise
Workplace: Onsite
Employment Type: Full time
Job Function: Administration & Executive Assistance
Seniority: Sr. Manager level

Key Responsibilities

  • •Lead multi-functional execution of process development priorities to accelerate DRAM technology learning and roadmap delivery.
  • •Drive wafer movement, data quality, process monitoring, and resolution of customer concerns to ensure strong development outcomes.
  • •Lead 24/7 shift operations, including benchmarks, cycle time, tool performance, and line-down recovery.
  • •Mentor and develop engineers, building a pipeline of talent into process development roles.
  • •Improve workflows, development systems, and AI adoption to increase efficiency and decision quality.

Pay and Benefits

Perks:Medical PlansDentalVisionPaid LeavePaid HolidaysParental Leave

Key Requirements

  • •Bachelor’s degree in Engineering or equivalent experience in the semiconductor field.
  • •Demonstrated leadership experience in a technical or manufacturing environment.
  • •Experience in at least one core area: wet process, CMP, wafer bonding, grinding, or edge trimming.
  • •Strong problem-solving and interpersonal skills.
  • •Deep expertise in one core process area and working knowledge across related areas.
Experience:Semiconductor process developmentDRAMTechnology development
Education:Bachelor's
Skills:LeadershipProblem-solvingInterpersonal skillsCollaborationMentoring
Tech Stack:AIGenerative AI

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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Glassdoor: 3.7
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