Member of Technical Staff, SoC Power and Physical Architect, Next-generation HBM Architecture

Micron Technology
California
Workplace: OnsiteFull timeUSD 191,000 - 334,000 annuallyFunction: Solutions Engineering & Sales EngineeringExperience: 8+ yearsEducation: mastersSkills: ["Data-driven analysis","Clear communication","Decision influence","Collaboration"]

Drive SoC-level specification for Micron’s next-generation, 3D-stacked high-bandwidth memory products for emerging AI systems. Own and advance power architecture and physical planning, including IP interface definitions, clocking and power sequencing, DFT requirements, PDN and thermal implications, and SoC floorplans. Collaborate with architecture and physical design teams while creating and maintaining clear SoC physical documentation and verification-ready specifications.

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Micron Technology
Micron Technology
3 weeks ago

Member of Technical Staff, SoC Power and Physical Architect, Next-generation HBM Architecture

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Job Summary

Drive SoC-level specification for Micron’s next-generation, 3D-stacked high-bandwidth memory products for emerging AI systems. Own and advance power architecture and physical planning, including IP interface definitions, clocking and power sequencing, DFT requirements, PDN and thermal implications, and SoC floorplans. Collaborate with architecture and physical design teams while creating and maintaining clear SoC physical documentation and verification-ready specifications.
Location: California
Workplace: Onsite
Employment Type: Full time
Job Function: Solutions Engineering & Sales Engineering
Seniority: Mid level

Key Responsibilities

  • •Define clocking architectures, power sequencing, power delivery, and on-die signal interfaces.
  • •Define and analyze on-die power delivery networks (PDN) and full-chip thermal implications, including power hotspot identification and mitigation.
  • •Define DFT architectures (e.g., scan chain topology) and set verification requirements.
  • •Define SoC floorplans in collaboration with physical designers.
  • •Compose and maintain clear SoC physical documentation.

Pay and Benefits

Salary: USD 191,000 - 334,000 annually
Equity and Bonus:Equity
Perks:Health InsuranceDentalVisionPaid LeavePaid Time-off

Key Requirements

  • •8+ years of industry experience delivering SoC hardware designs.
  • •Experience with high-bandwidth memory (HBM) architectures.
  • •Ability to influence decisions through data-driven analysis and clear communication.
  • •A Masters or PhD in Computer Science, Computer Engineering, Electrical Engineering, or equivalent experience.
  • •Experience with circuit design, including IP interface requirements, power delivery behavior, and clocking constraints.
Experience:8+ yearsHBMSoC hardwareSemiconductorsNext-generation memory
Education:Master's
Skills:Data-driven analysisClear communicationDecision influenceCollaboration
Tech Stack:PrimePowerPrimeShieldRedHawkICC2Static timing analysisSynthesisDFTClockingPower sequencingPower delivery networks

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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Glassdoor: 3.7
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