Cisco

1 day ago

Silicon Photonic Packaging Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 46 minutes agoStatus: Live

Job Summary

Drive silicon photonic packaging process excellence by transitioning products from NPI to high-volume manufacturing. Create and maintain engineering specifications and process documentation, provide hands-on IC packaging support across OSAT and contract manufacturers, and lead packaging failure analysis with root-cause resolution. Partner with cross-functional teams to monitor process performance using SPC and implement continuous improvements to improve reliability, durability, and performance of optics products.

Location: Taipei

Workplace: Hybrid

Employment Type: Full time

Job Function: Industrial, Process & Manufacturing Engineering

Seniority: Mid level

Key Responsibilities

•Facilitate the transition of silicon photonic products from NPI to high-volume manufacturing (HVM).
•Draft, maintain, and optimize technical engineering specifications and process documentation for manufacturing consistency and quality.
•Provide hands-on support for IC packaging and ensure adherence to process flows across OSAT and contract manufacturer partners.
•Identify, document, and analyze packaging process failures, applying failure analysis to drive root cause resolution.
•Monitor process performance with cross-functional teams and use SPC to implement continuous improvements.

Key Requirements

•Bachelor’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related technical field.
•Minimum of 2 years of professional experience in IC packaging or semiconductor manufacturing.
•Proficiency in data analysis tools, specifically Microsoft Excel and JMP.
•Working knowledge of structured problem-solving methodologies, including 8D, and Statistical Process Control (SPC).

Experience:2+ yearsSemiconductor manufacturing

Education:Bachelor's in Materials Science, Mechanical Engineering, Electrical Engineering (or related technical field)

Skills:CollaborationProblem-solvingContinuous improvementTechnical documentation

Tech Stack:Microsoft ExcelJMPStatistical Process Control (SPC)8DOSATCMFailure analysisJEDECPCB layoutStack-upsRouting constraintsSignal/power integrity

Company Brief

Cisco

Global technology company that designs, manufactures, and sells networking hardware, telecommunications equipment, and high-technology services and products for enterprises, service providers, and governments worldwide.

Industry: Networking Equipment

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: San Jose, United States

Founded: 1984

Glassdoor: 4.0

Website LinkedIn Glassdoor

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Cisco

1 day ago

Silicon Photonic Packaging Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 46 minutes agoStatus: Live

Job Summary

Location: Taipei

Workplace: Hybrid

Employment Type: Full time

Job Function: Industrial, Process & Manufacturing Engineering

Seniority: Mid level

Key Responsibilities

•Facilitate the transition of silicon photonic products from NPI to high-volume manufacturing (HVM).
•Draft, maintain, and optimize technical engineering specifications and process documentation for manufacturing consistency and quality.
•Provide hands-on support for IC packaging and ensure adherence to process flows across OSAT and contract manufacturer partners.
•Identify, document, and analyze packaging process failures, applying failure analysis to drive root cause resolution.
•Monitor process performance with cross-functional teams and use SPC to implement continuous improvements.

Key Requirements

•Bachelor’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related technical field.
•Minimum of 2 years of professional experience in IC packaging or semiconductor manufacturing.
•Proficiency in data analysis tools, specifically Microsoft Excel and JMP.
•Working knowledge of structured problem-solving methodologies, including 8D, and Statistical Process Control (SPC).

Experience:2+ yearsSemiconductor manufacturing

Education:Bachelor's in Materials Science, Mechanical Engineering, Electrical Engineering (or related technical field)

Skills:CollaborationProblem-solvingContinuous improvementTechnical documentation

Tech Stack:Microsoft ExcelJMPStatistical Process Control (SPC)8DOSATCMFailure analysisJEDECPCB layoutStack-upsRouting constraintsSignal/power integrity

Company Brief

Cisco

Industry: Networking Equipment

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: San Jose, United States

Founded: 1984

Glassdoor: 4.0

Website LinkedIn Glassdoor