2027 Masters ASIC Package Engineering Co-op/Intern

AMD
Austin
Workplace: HybridInternshipFunction: Hardware, Embedded & Systems EngineeringEducation: mastersSkills: ["Highly motivated","Enthusiastic","Detail-oriented"]

Support ASIC package engineering by partnering with engineers on package design and package development priorities. Train to complete substrate, interposer, and bump designs, and contribute to design verification implementation. Analyze yield and defect metrics to improve performance and efficiency, and evaluate/benchmark packaging materials to find cost-efficient options that meet yield and performance requirements. Interns work onsite/hybrid full-time across the co-op/intern term.

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FursaFursa
AMD
AMD
1 day ago

2027 Masters ASIC Package Engineering Co-op/Intern

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Last checked: 15 hours agoStatus: Live

Job Summary

Support ASIC package engineering by partnering with engineers on package design and package development priorities. Train to complete substrate, interposer, and bump designs, and contribute to design verification implementation. Analyze yield and defect metrics to improve performance and efficiency, and evaluate/benchmark packaging materials to find cost-efficient options that meet yield and performance requirements. Interns work onsite/hybrid full-time across the co-op/intern term.
Location: Austin
Workplace: Hybrid
Employment Type: Internship
Job Function: Hardware, Embedded & Systems Engineering
Seniority: Intern level

Key Responsibilities

  • •Support package design and package development engineers in prioritizing and optimizing new projects.
  • •Complete substrate, interposer, and bump designs for AMD products, test vehicles, and probe card substrates.
  • •Work on design verification implementation to ensure design performance, quality, and efficiency.
  • •Analyze yield and defect metrics to improve design performance and yield.
  • •Evaluate and benchmark packaging materials and interact with partners to meet cost, performance, and yield requirements.

Key Requirements

  • •Currently enrolled in a US-based university in a Masters degree program in Electrical engineering, Engineering Science, Computer Engineering, Mechanical Engineering, Material Science Engineering, or a related field.
  • •Knowledge or experience in transmission lines and electric circuits.
  • •Experience with package, silicon, or PCB design software.
  • •Scripting skills in Perl, Python, and/or SQL.
  • •Knowledge of semiconductor theory and packaging process/technology, plus familiarity with data analytics and visualization tools like Power BI.
Education:Master's in Electrical engineering, Engineering Science, Computer Engineering, Mechanical Engineering, Material Science Engineering, or a related field
Skills:Highly motivatedEnthusiasticDetail-oriented
Languages:English
Tech Stack:PerlPythonSQLPower BIPCB designPackage design software

Eligibility

Work Authorization:Authorization required. Sponsorship not provided.

Company Brief

AMD
Designs and produces semiconductor products including CPUs, GPUs, and adaptive SoCs for consumer, enterprise, and embedded markets, competing across PCs, data centers, and gaming industries.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1969
Glassdoor
Glassdoor: 3.9
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