Intel

1 week ago

Packaging Module Development Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 2 minutes agoStatus: Live

Job Summary

Develop and qualify solder ball attach and chip attach processes for electronic packaging assembly in new product and test vehicle technology development. Own process and technology development for CAM/SLAM (including die/DRAM attach, component attach, solder ball attach, and deflux), from pathfinding and material qualification through ramping to high-volume manufacturing. Apply DOE, SPC, FMEA, and yield/quality optimization to create process specifications and document improvements while collaborating cross-functionally to characterize materials, identify failure modes, and recommend technologies.

Location: Malaysia

Workplace: Onsite

Employment Type: Full time

Job Function: Product Management

Seniority: Mid level

Key Responsibilities

•Drive process and technology development for electronic packaging assembly for new product and test vehicles, focused on solder ball attach or chip attach processes.
•Develop, qualify, and ramp materials to transfer technologies to high-volume manufacturing in factories.
•Create process specifications using DOE and data analysis principles and document improvements via white papers.
•Optimize manufacturing efficiency and develop processes to meet quality, reliability, cost, yield, productivity, and manufacturability requirements.
•Conduct fundamental studies and experiments to characterize materials and processes, identify failure modes, assess feasibility, and recommend technologies while collaborating cross-functionally.

Key Requirements

•Earn a BEng/MEng/MSc/PhD in a relevant engineering discipline (Mechanical, Materials, Chemical, Electrical, Physics, or Mechatronics).
•5+ years of experience working in electronic packaging and/or development experience.
•R&D background with experience in chip attach, deflux, or ball attach processes.
•Strong data analysis and problem-solving capabilities, with ability to work under tight timelines and pressure.
•Excellent influencing, written, and verbal communication skills.

Experience:Electronic packagingResearch and development

Education:Bachelor's

Skills:InfluencingWritten communicationVerbal communicationData analysisProblem solving

Tech Stack:CAMSLAMDesign of Experiments (DOE)Statistical Process Control (SPC)Failure Modes/Effects Analysis (FMEA)DefluxChip AttachSolder Ball AttachComponent AttachYield improvementQualityOptimization

Company Brief

Intel

Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1968

Glassdoor: 3.8

Website LinkedIn Glassdoor

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Intel

1 week ago

Packaging Module Development Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 2 minutes agoStatus: Live

Job Summary

Location: Malaysia

Workplace: Onsite

Employment Type: Full time

Job Function: Product Management

Seniority: Mid level

Key Responsibilities

•Drive process and technology development for electronic packaging assembly for new product and test vehicles, focused on solder ball attach or chip attach processes.
•Develop, qualify, and ramp materials to transfer technologies to high-volume manufacturing in factories.
•Create process specifications using DOE and data analysis principles and document improvements via white papers.
•Optimize manufacturing efficiency and develop processes to meet quality, reliability, cost, yield, productivity, and manufacturability requirements.
•Conduct fundamental studies and experiments to characterize materials and processes, identify failure modes, assess feasibility, and recommend technologies while collaborating cross-functionally.

Key Requirements

•Earn a BEng/MEng/MSc/PhD in a relevant engineering discipline (Mechanical, Materials, Chemical, Electrical, Physics, or Mechatronics).
•5+ years of experience working in electronic packaging and/or development experience.
•R&D background with experience in chip attach, deflux, or ball attach processes.
•Strong data analysis and problem-solving capabilities, with ability to work under tight timelines and pressure.
•Excellent influencing, written, and verbal communication skills.

Experience:Electronic packagingResearch and development

Education:Bachelor's

Skills:InfluencingWritten communicationVerbal communicationData analysisProblem solving

Company Brief

Intel

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1968

Glassdoor: 3.8

Website LinkedIn Glassdoor