Integrated Circuit Packaging Architect Engineer
AMD
San Jose
Workplace: HybridFull timeFunction: Hardware, Embedded & Systems EngineeringSkills: ["Leadership","Cross-functional collaboration","Communication","Technical problem solving","Data analysis"]Drive advanced semiconductor packaging architecture across client, server, gaming, and GPU products. Collaborate with product design teams and technology partners to define a packaging roadmap covering architecture, process definition, DFM and DFY guidelines. Lead technology development from concept through full qualification, working with manufacturing partners to establish design rules, improve yield, and address reliability and process development challenges via data-driven problem solving.

