Packaging Research and Development Engineer

Intel
Phoenix
Workplace: OnsiteFull timeUSD 133,800 - 188,890 annuallyFunction: Research & Scientific (R&D)Education: mastersSkills: ["Written and verbal communication","Teamwork","Engineering troubleshooting","Analytical skills","Working with ambiguity","Cross-functional collaboration"]

Develop and scale advanced substrate packaging technology by owning process and material development on the factory floor. Define equipment configurations and process specifications, plan and run DOE studies to characterize process windows, and drive continuous improvements across yield, reliability, quality, cost, automation, and productivity. Collaborate with cross-functional teams to support substrate technology development and interact with equipment/material suppliers while adapting to ambiguity and flexible working hours.

Loading

Loading job details...

Preparing the role view and application actions.

FursaFursa
Intel
Intel
4 days ago

Packaging Research and Development Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 5 hours agoStatus: Live
Reposted: similar role first listed 5 months ago

Job Summary

Develop and scale advanced substrate packaging technology by owning process and material development on the factory floor. Define equipment configurations and process specifications, plan and run DOE studies to characterize process windows, and drive continuous improvements across yield, reliability, quality, cost, automation, and productivity. Collaborate with cross-functional teams to support substrate technology development and interact with equipment/material suppliers while adapting to ambiguity and flexible working hours.
Location: Phoenix
Workplace: Onsite
Employment Type: Full time
Job Function: Research & Scientific (R&D)
Seniority: Mid level

Key Responsibilities

  • •Define and establish equipment configurations, process specifications, and integrated process flow for new process technologies.
  • •Plan and conduct comprehensive DOEs to characterize the process window and understand process/equipment/materials interactions.
  • •Drive continuous process improvements focused on process capability/stability, quality/reliability, cost/yield, automation, and productivity.
  • •Lead and participate in cross-functional and cross-organizational teams supporting substrate technology development.
  • •Interact with equipment and material suppliers and work primarily on the factory floor to scale substrate packaging technology.
Travel: Low travel

Pay and Benefits

Salary: USD 133,800 - 188,890 annually
Perks:Health InsuranceRetirementPaid LeaveEquity

Key Requirements

  • •Master’s degree in a relevant science/engineering discipline (preferably Mechanical, Chemical, Materials Science, Physics, or Chemistry) with 3+ years of related experience, or PhD with 1+ years of related experience.
  • •Solid mechanical and materials engineering background, including materials characterization, mechanical design principles, reliability assessments, and failure analysis for advanced packaging and manufacturing tech development.
  • •Experience developing semiconductor packaging/substrates/embedded die/heterogeneous integration technologies with hands-on work with process equipment, factory operations, and equipment suppliers.
  • •Expertise in DOE and statistical analysis for process development, root cause investigation, and driving improvements in yield, reliability, quality, and process capability.
  • •Strong process characterization and optimization skills, including working with organic/inorganic materials and using techniques such as DSC, TGA, D/TMA, Titration, ICPMS, FTIR, XPS, TOFSIMS, EDX, and SEM; JMP/JSL, Python, relational databases, and machine learning are desirable.
Experience:Semiconductor packagingManufacturingResearch & innovationProcess developmentStatistical analysis
Education:Master's in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, or Chemistry (or other relevant science/engineering discipline)
Skills:Written and verbal communicationTeamworkEngineering troubleshootingAnalytical skillsWorking with ambiguityCross-functional collaboration
Tech Stack:DOEStatistical analysisRoot cause investigationSPCJMPJSLPythonRelational databasesMachine learningDSCTGAD/TMATitrationICPMSFTIRXPSTOFSIMSEDXSEMEquipment troubleshooting

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
Glassdoor
Glassdoor: 3.8
WebsiteLinkedInGlassdoor