HBM IO Architecture, Principal Engineer

Micron Technology
Texas
Workplace: OnsiteFull timeFunction: Architecture & Urban PlanningExperience: 7+ yearsEducation: bachelorsSkills: ["Communication","Technical leadership","Influencing technical direction"]

Serve as the technical authority for HBM IO circuit and PHY architecture within Micron’s Heterogeneous Integration Group. Define and own HBM IO and data path architecture across multiple generations, including TSV link schemes, training features, and silicon validation. Architect high-speed IO circuits targeting best-in-class bandwidth and power efficiency, while establishing and driving IO/TSV design standards across design, product, package, and process teams.

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Micron Technology
Micron Technology
3 months ago

HBM IO Architecture, Principal Engineer

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Job Summary

Serve as the technical authority for HBM IO circuit and PHY architecture within Micron’s Heterogeneous Integration Group. Define and own HBM IO and data path architecture across multiple generations, including TSV link schemes, training features, and silicon validation. Architect high-speed IO circuits targeting best-in-class bandwidth and power efficiency, while establishing and driving IO/TSV design standards across design, product, package, and process teams.
Location: Texas
Workplace: Onsite
Employment Type: Full time
Job Function: Architecture & Urban Planning
Seniority: Mid level

Key Responsibilities

  • •Define and own HBM IO and data path architecture across multiple product generations, from pathfinding through tape-out.
  • •Architect and analyze TSV-based HBM link schemes, including topology, signaling strategy, and parasitic co-design.
  • •Define and drive HBM PHY IO training features to ensure robust PVT margin across product generations.
  • •Architect high-speed IO circuits for the HBM interface die targeting best-in-class bandwidth and power efficiency.
  • •Establish IO and TSV design standards and drive alignment across design, product, package, and process teams.

Pay and Benefits

Perks:MedicalDentalVisionPaid LeavePaid Time-offPaid Holidays

Key Requirements

  • •Bachelor’s degree in Electrical Engineering or equivalent experience.
  • •7+ years of hands-on experience in memory or high-speed IO design with proven silicon success.
  • •Deep expertise in analog and mixed-signal CMOS circuit design and simulation.
  • •Strong experience with high-speed IO architectures such as Rx/Tx, PLL, DLL, DCC, phase interpolators, or equalizers.
  • •Excellent communication skills with the ability to influence technical direction across teams.
Experience:7+ yearsMemoryHigh-speed IOHBMDRAMAdvanced memory interfacesAnalog and mixed-signal designSilicon validation
Education:Bachelor's in Electrical Engineering
Skills:CommunicationTechnical leadershipInfluencing technical direction
Tech Stack:HBMIO architecturePHY architectureTSV technologyIO trainingSilicon validationAnalogMixed-signalCMOSSimulationHigh-speed IORx/TxPLLDLLDCCPhase interpolatorsEqualizersData path architectureHBM link schemesJEDEC

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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